/*********************************************************************************** * (c) Ger Versluis 2000 version 5.411 24 December 2001 (updated Jan 31st, 2003 by Dynamic Drive for Opera7) * For info write to menus@burmees.nl * * You may remove all comments for faster loading * ***********************************************************************************/ var NoOffFirstLineMenus=9; // Number of first level items var LowBgColor='#ffffff'; var LowSubBgColor='#f2f4f6'; var HighBgColor='#1d6849'; var HighSubBgColor='#1d6849'; var FontLowColor='#3b5b7b'; var FontSubLowColor='#004444'; //old: #3b5b7b var FontHighColor='#ffffff'; var FontSubHighColor='#ffffff'; var BorderColor='#dfdfdf'; var BorderSubColor='#c0c0c0'; var BorderWidth=1; var BorderBtwnElmnts=1; var FontFamily="verdana,arial,comic sans ms,technical" // Font family menu items var FontSize=7.5; // Font size menu items var FontBold=1; // Bold menu items 1 or 0 var FontItalic=0; // Italic menu items 1 or 0 var MenuTextCentered='left'; // Item text position 'left', 'center' or 'right' var MenuCentered='left'; // Menu horizontal position 'left', 'center' or 'right' var MenuVerticalCentered='top'; // Menu vertical position 'top', 'middle','bottom' or static var ChildOverlap=.02; // horizontal overlap child/ parent var ChildVerticalOverlap=.02; // vertical overlap child/ parent var StartTop=140; // Menu offset x coordinate var StartLeft=10; // Menu offset y coordinate var VerCorrect=0; // Multiple frames y correction var HorCorrect=0; // Multiple frames x correction var LeftPaddng=3; // Left padding var TopPaddng=2; // Top padding var FirstLineHorizontal=0; // SET TO 1 FOR HORIZONTAL MENU, 0 FOR VERTICAL var MenuFramesVertical=1; // Frames in cols or rows 1 or 0 var DissapearDelay=1000; // delay before menu folds in var TakeOverBgColor=1; // Menu frame takes over background color subitem frame var FirstLineFrame='navig'; // Frame where first level appears var SecLineFrame='space'; // Frame where sub levels appear var DocTargetFrame='space'; // Frame where target documents appear var TargetLoc=''; // span id for relative positioning var HideTop=0; // Hide first level when loading new document 1 or 0 var MenuWrap=0; // enables/ disables menu wrap 1 or 0 (old:1) var RightToLeft=0; // enables/ disables right to left unfold 1 or 0 var UnfoldsOnClick=0; // Level 1 unfolds onclick/ onmouseover var WebMasterCheck=0; // menu tree checking on or off 1 or 0 var ShowArrow=1; // Uses arrow gifs when 1 var KeepHilite=1; // Keep selected path highligthed var Arrws=['tri.gif',5,10,'tridown.gif',10,5,'trileft.gif',5,10]; // Arrow source, width and height function BeforeStart(){return} function AfterBuild(){return} function BeforeFirstOpen(){return} function AfterCloseAll(){return} // Menu tree // MenuX=new Array(Text to show, Link, background image (optional), number of sub elements, height, width); // For rollover images set "Text to show" to: "rollover:Image1.jpg:Image2.jpg" Menu1=new Array("INTRO","http://www.acrosemi.com","",0,20,120); Menu2=new Array("HOME","http://www.acrosemi.com/english.php","",0,20,120); Menu3=new Array("CORPORATE","http://www.acrosemi.com/english_about.php","",2); Menu3_1=new Array("About Acrosemi Corporation","http://www.acrosemi.com/english_about.php","",0,20,220); Menu3_2=new Array("A Letter from the Founder","http://www.acrosemi.com/english_letter.php","",0); Menu4=new Array("PRODUCTS","http://www.acrosemi.com/english_products.php","",3,"",95); Menu4_1=new Array("By Alphabetical Order (A-Z)","http://www.acrosemi.com/eng_ProductsByOrder.php","",0,20,200); Menu4_2=new Array("By Category","http://www.acrosemi.com/eng_ProductsCategory.php","",5); Menu4_2_1=new Array("Semiconductor Packaging / Assembly Equipment","http://www.acrosemi.com/eng_products_WB.php","",6,20,350); Menu4_2_1_1=new Array("Wafer Saw (Dicing) Equipment","http://www.acrosemi.com/eng_products_ADT.php","",0,20,360); Menu4_2_1_2=new Array("Die Attach Machines","http://www.acrosemi.com/eng_DieBonding.php","",0); Menu4_2_1_3=new Array("Wire Bonders","http://www.acrosemi.com/eng_WireBonding.php","",0); Menu4_2_1_4=new Array("Molding Equipment","http://www.acrosemi.com/eng_products_TopA_Semi2.php","",0,20,220); Menu4_2_1_5=new Array("Hermetic Sealing Equipment","http://www.acrosemi.com/eng_products_POLARIS.php","",0); Menu4_2_1_6=new Array("High-volume Soldering, Brazing and Glass Sealing","http://www.acrosemi.com/eng_products_SST.php","",0); Menu4_2_2=new Array("Surface Mount Technology","http://www.acrosemi.com/eng_products_Samsung.php","",7); Menu4_2_2_1=new Array("Screen Printers","http://www.acrosemi.com/eng_products_AMI.php","",0,20,220); Menu4_2_2_2=new Array("Full-Line SMT","http://www.acrosemi.com/eng_products_Samsung.php","",0); Menu4_2_2_3=new Array("Solder Reflow/Curing Systems ","http://www.acrosemi.com/eng_products_sikama.php","",0); Menu4_2_2_4=new Array("AOI & X-Ray","http://www.acrosemi.com/eng_products_YESTech.php","",0); Menu4_2_2_5=new Array("Rework BGA","http://www.acrosemi.com/eng_products_DIC.php","",0); Menu4_2_2_6=new Array("Defluxing Systems","http://www.acrosemi.com/eng_Aqueous_Defluxing.php","",0); Menu4_2_2_7=new Array("Stencil Cleaning Systems","http://www.acrosemi.com/eng_Aqueous_Stencil_Cleaning.php","",0); Menu4_2_3=new Array("Cleanroom / Lab Equipment","http://www.acrosemi.com/eng_products_UNIVERSAL_FAR_EAST.php","",6); Menu4_2_3_1=new Array("Reliability, Process, Wet Benches","http://www.acrosemi.com/eng_products_UNIVERSAL_FAR_EAST.php","",0,20,265); Menu4_2_3_2=new Array("Mask Aligners","http://www.acrosemi.com/eng_products_NXQ.php","",0); Menu4_2_3_3=new Array("Probe Stations","http://www.acrosemi.com/download/probe_stations.pdf","",0); Menu4_2_3_4=new Array("Wafer Mounters","http://www.acrosemi.com/eng_wafer_mounters.php","",0); Menu4_2_3_5=new Array("Wafer Bonders","http://www.acrosemi.com/eng_SST_wafer_bonders.php","",0); Menu4_2_3_6=new Array("Wafer Inspection Systems","http://www.acrosemi.com/download/wafer_inspection.pdf","",0); Menu4_2_4=new Array("Test & Measurement Equipment","http://www.acrosemi.com/english_machines_testing.php","",7); Menu4_2_4_1=new Array("Testing & Inspection","http://www.acrosemi.com/english_machines_testing.php","",0,20,330); Menu4_2_4_2=new Array("Temperature Testing Systems","http://www.acrosemi.com/eng_universal_TEMPERATURE_TESTING.php","",0); Menu4_2_4_3=new Array("Product and Package Testing Equipment","http://www.acrosemi.com/eng_universal_Package_Testing_Equipment.php","",0); Menu4_2_4_4=new Array("Cleanliness Testers","http://www.acrosemi.com/eng_Aqueous_Cleanliness_Testers.php","",0); Menu4_2_4_5=new Array("UV Curable Dicing Tape & UV Exposure System","http://www.acrosemi.com/eng_sec7_tape.php#UV%20Curable%20Dicing%20Tape","",0); Menu4_2_4_6=new Array("Ovens","http://www.etsp.co.kr/Industrial-Oven-MTS-TO-ser.html","",0); Menu4_2_4_7=new Array("Chambers","http://www.etsp.co.kr/product.html","",0); Menu4_2_5=new Array("Others","http://www.acrosemi.com/english_products.php","",0); Menu4_3=new Array("By Company","http://www.acrosemi.com/english_products.php","",19); Menu4_3_1=new Array("West Bond","http://www.acrosemi.com/eng_products_WB.php","",8,20,300); Menu4_3_1_1=new Array("Manual Die Bonders","http://www.acrosemi.com/english_machines_manual_die_bonders.php","",0,20,460); Menu4_3_1_2=new Array("Manual Wire Bonders","http://www.acrosemi.com/english_machines_manual_wire_bonders.php","",0); Menu4_3_1_3=new Array("Semi-Automatic Wire Bonders","http://www.acrosemi.com/english_machines_semi.php","",0); Menu4_3_1_4=new Array("Automatic Wire Bonders","http://www.acrosemi.com/english_machines_auto.php","",0); Menu4_3_1_5=new Array("Pull Test Machines","http://www.acrosemi.com/english_machines_tester.php","",0); Menu4_3_1_6=new Array("Full range of semiconductor assembly processes recommendations","http://www.acrosemi.com/eng_recommend.php","",0); Menu4_3_1_7=new Array("","","menu_div.gif",0,2); Menu4_3_1_8=new Array("Accessories","http://www.acrosemi.com/english_WBaccessories.php","",0); Menu4_3_2=new Array("Advanced Dicing Technologies (ADT)","http://www.acrosemi.com/eng_products_ADT.php","",6,20,200); Menu4_3_2_1=new Array("Dicing Saws","http://www.acrosemi.com/eng_ADT_dicing_saws.php","",2,20,210); Menu4_3_2_1_1=new Array("7100 Series","eng_ADT_7100_Models.php","",0,20,110); Menu4_3_2_1_2=new Array("7100 Options","eng_ADT_7100_Options.php","",0); Menu4_3_2_2=new Array("Automatic Dicing Saws","http://www.acrosemi.com/eng_ADT_automatic_dicing_saws.php","",0); Menu4_3_2_3=new Array("Laser Scribing System","http://www.acrosemi.com/eng_ADT_Laser_Scribing_Technology.php","",0); Menu4_3_2_4=new Array("Dicing Tools ","http://www.acrosemi.com/eng_ADT_dicing_tools.php","",0); Menu4_3_2_5=new Array("Peripheral Equipment","http://www.acrosemi.com/eng_ADT_Peripheral_Equipment.php","",0); Menu4_3_2_6=new Array("Customized Dicing Solutions","http://www.acrosemi.com/eng_ADT_Customized_Dicing_Solutions.php","",0); Menu4_3_3=new Array("SemiProbe","http://www.acrosemi.com/eng_products_SemiProbe.php","",6,20,150); Menu4_3_3_1=new Array("Manual Probers","http://www.acrosemi.com/eng_semiprobe_manual_probers.php","",4,20,200); Menu4_3_3_1_1=new Array("Packaged Part & PCB Probers","eng_semiprobe_manual_probers.php#Packaged","",0,20,200); Menu4_3_3_1_2=new Array("LA-150","eng_semiprobe_manual_probers.php#LA150","",0); Menu4_3_3_1_3=new Array("LA-120","eng_semiprobe_manual_probers.php#LA120","",0); Menu4_3_3_1_4=new Array("Probe System for Life (PS4L)","eng_semiprobe_manual_probers.php#PS4L","",0); Menu4_3_3_2=new Array("Semi-Automatic Probers","http://www.acrosemi.com/eng_semiprobe_semi-automatic_probers.php","",4,20,50); Menu4_3_3_2_1=new Array("SA-4","eng_semiprobe_semiauto_SA4.php","",0,20,50); Menu4_3_3_2_2=new Array("SA-6","eng_semiprobe_semiauto_SA6.php","",0); Menu4_3_3_2_3=new Array("SA-8","eng_semiprobe_semiauto_SA8.php","",0); Menu4_3_3_2_4=new Array("SA-12","eng_semiprobe_semiauto_SA12.php","",0); Menu4_3_3_3=new Array("Fully Automatic Probers","http://www.acrosemi.com/eng_semiprobe_automatic_probers.php","",0); Menu4_3_3_4=new Array("Specialty Probers","http://www.acrosemi.com/eng_semiprobe_specialty_probers.php","",0); Menu4_3_3_5=new Array("Accessories","http://semiprobe.com/Accessories.php","",0); Menu4_3_3_6=new Array("Optics","http://www.acrosemi.com/eng_semiprobe_optics.php","",0); Menu4_3_4=new Array("Semiconductor Equipment Corp. (S.E.C.)","http://www.acrosemi.com/eng_products_SEC.php","",15,20,220); Menu4_3_4_1=new Array("Flip Chip Die Bonder","http://www.acrosemi.com/eng_sec850spc.php","",0,20,250); Menu4_3_4_2=new Array("Eagle Omni Die Bonder","http://www.acrosemi.com/eng_sec860spc.php","",0); Menu4_3_4_3=new Array("Manual Pick & Place System","http://www.acrosemi.com/eng_sec830spc.php","",0); Menu4_3_4_4=new Array("Die Ejector Grid","http://www.acrosemi.com/eng_sec4800spc.php","",0); Menu4_3_4_5=new Array("Die Ejector System (Poker Plate)","http://www.acrosemi.com/eng_sec4750spc.php","",0); Menu4_3_4_6=new Array("Semiconductor Wafer Dicing Tape","http://www.acrosemi.com/eng_sec7_tape.php","",0); Menu4_3_4_7=new Array("UV Curable Dicing Tape","http://www.acrosemi.com/eng_sec7_tape.php#UV Curable Dicing Tape","",0); Menu4_3_4_8=new Array("High Purity Tape","http://www.acrosemi.com/eng_sec7_tape.php#High Purity","",0); Menu4_3_4_9=new Array("UV Exposure System","http://www.acrosemi.com/eng_sec360spc.php","",0); Menu4_3_4_10=new Array("Wafer/Frame Tape Applicator","http://www.acrosemi.com/eng_sec300spc.php","",0); Menu4_3_4_11=new Array("Wafer/Frame Tape Applicators","http://www.acrosemi.com/eng_sec3100_3150spc.php","",0); Menu4_3_4_12=new Array("Wafer/Backlap Applicator","http://www.acrosemi.com/eng_sec3200_3250spc.php","",0); Menu4_3_4_13=new Array("Hot Gas Rework Module","http://www.acrosemi.com/eng_sec430spc.php","",0); Menu4_3_4_14=new Array("Hot Gas Rework Station","http://www.acrosemi.com/eng_sec450spc.php","",0); Menu4_3_4_15=new Array("Die Matrix Expander (New Product!)","http://www.acrosemi.com/eng_sec1810spc.php","",0); Menu4_3_5=new Array("Samsung SMT","http://www.acrosemi.com/eng_products_Samsung.php","",6,20,200); Menu4_3_5_1=new Array("Loader / Unloader","http://www.acrosemi.com/eng_samsung_loaders.php","",0,20,200); Menu4_3_5_2=new Array("Dispenser","http://www.acrosemi.com/eng_samsung_dispensers.php","",0); Menu4_3_5_3=new Array("Chip Mounter - CP Series","http://www.acrosemi.com/eng_samsung_CP.php","",0); Menu4_3_5_4=new Array("Chip Mounter - SM Series","http://www.acrosemi.com/eng_samsung_SM.php","",0); Menu4_3_5_5=new Array("Reflower","http://www.acrosemi.com/eng_samsung_reflowers.php","",0); Menu4_3_5_6=new Array("Full-line SMT","http://www.acrosemi.com/eng_samsung_fulllineSMT.php","",0); Menu4_3_6=new Array("Heraeus","http://www.acrosemi.com/eng_products_Heraeus.php","",14,20,220); Menu4_3_6_1=new Array("Solder Paste","http://heraeus-contactmaterials.com/en/products/solderpaste/landingpage_solder_pastes_b.aspx","",0,20,220); Menu4_3_6_2=new Array("Fluxes","http://heraeus-contactmaterials.com/en/products/fluxes/landingpage_fluxes_b.aspx","",0); Menu4_3_6_3=new Array("SMT Adhesive","http://heraeus-contactmaterials.com/en/products/smtadh/productpage_smt_adhesives_1.aspx","",0); Menu4_3_6_4=new Array("Conductive Adhesive","http://heraeus-contactmaterials.com/en/products/condadh/productpage_conductive_adhesive.aspx","",0); Menu4_3_6_5=new Array("Non Conductive Adhesive","http://heraeus-contactmaterials.com/en/products/noncond_adh/product_page_non_conductive__adhesive.aspx","",0); Menu4_3_6_6=new Array("Heat Conductive Adhesive","http://heraeus-contactmaterials.com/en/products/heatcondadh/productpage_heat_conductive_adhesive.aspx","",0); Menu4_3_6_7=new Array("Solder Powder","http://heraeus-contactmaterials.com/en/products/solderpowder/productp_solderpowder.aspx","",0); Menu4_3_6_8=new Array("Die-Attach Solder Wire","http://heraeus-contactmaterials.com/en/products/draehte/productpage_heat_conductive_adhesive_2.aspx","",0); Menu4_3_6_9=new Array("Die-Attach Solder Paste","http://heraeus-contactmaterials.com/en/products/solderpaste/landingpage_solder_pastes_b.aspx","",0); Menu4_3_6_10=new Array("Fluxes for BGA CSP","http://heraeus-contactmaterials.com/en/products/fluxes/landingpage_fluxes_b.aspx","",0); Menu4_3_6_11=new Array("Micro Solder Sphere","http://heraeus-contactmaterials.com/en/products/solderspheres/productpage_solderspheres.aspx","",0); Menu4_3_6_12=new Array("Dippable Paste","http://heraeus-contactmaterials.com/en/products/dippablepastes/productpage_dippablepastes.aspx","",0); Menu4_3_6_13=new Array("Conductive Adhesive (MSL)","http://heraeus-contactmaterials.com/en/products/condadh/productpage_conductive_adhesive.aspx","",0); Menu4_3_6_14=new Array("Non Conductive Adhesive (MSL)","http://heraeus-contactmaterials.com/en/products/noncond_adh/product_page_non_conductive__adhesive.aspx","",0); Menu4_3_7=new Array("Affiliated Manufacturers, Inc. (A.M.I.)","http://www.acrosemi.com/eng_products_AMI.php","",6,20,220); Menu4_3_7_1=new Array("Screen & Stencil Printers","http://www.acrosemi.com/eng_AMI_screen_printers.php","",0,20,280); Menu4_3_7_2=new Array("Automated Substrate Handling Systems","http://www.acrosemi.com/eng_AMI_Automated.php","",0); Menu4_3_7_3=new Array("Conveyor / Dryers","http://www.acrosemi.com/eng_AMI_dryers.php","",0); Menu4_3_7_4=new Array("Vision Alignment","http://www.acrosemi.com/eng_AMI_vision.php","",0); Menu4_3_7_5=new Array("Roller Micrometers","http://www.acrosemi.com/eng_AMI_roller.php","",0); Menu4_3_7_6=new Array("Screen Print Supplies and Accessories","http://www.acrosemi.com/eng_AMI_accessories.php","",0); Menu4_3_8=new Array("YESTech, Inc.","http://www.acrosemi.com/eng_products_YESTech.php","",6); Menu4_3_8_1=new Array("AOI - Model YTV F1 Series","eng_YESTech_AOI_YTVF1.php","",0,20,210); Menu4_3_8_2=new Array("AOI - Model YTV M1","eng_YESTech_AOI_YTVM1.php","",0); Menu4_3_8_3=new Array("AOI - Model YTV B3","eng_YESTech_AOI_YTVB3.php","",0); Menu4_3_8_4=new Array("X-Ray - Model YTX 3000","eng_YESTech_XRay_YTX3000.php","",0); Menu4_3_8_5=new Array("X-Ray - Model YTX 6000","eng_YESTech_XRay_YTX6000.php","",0); Menu4_3_8_6=new Array("X-Ray - Model YTX X1","eng_YESTech_XRay_YTXX1.php","",0); Menu4_3_9=new Array("Sikama International, Inc.","http://www.acrosemi.com/eng_products_Sikama.php","",8); Menu4_3_9_1=new Array("Falcon 5x5 Conduction System","eng_sikama_falcon5x5.php","",0,20,300); Menu4_3_9_2=new Array("Falcon 8 Reflow/Curing Series","eng_sikama_falcon8.php","",0); Menu4_3_9_3=new Array("Falcon 1200 Reflow Solder/Curing System","eng_sikama_falcon1200.php","",0); Menu4_3_9_4=new Array("Falcon 8500 Reflow Solder/Curing System","eng_sikama_falcon8500.php","",0); Menu4_3_9_5=new Array("Falcon Ultra Profile 2000","eng_sikama_falconUP2000.php","",0); Menu4_3_9_6=new Array("Falcon Ultra Profile 4000","eng_sikama_falconUP4000.php","",0); Menu4_3_9_7=new Array("Falcon Inline Coating System (ICS) 412","eng_sikama_falconICS.php","",0); Menu4_3_9_8=new Array("Indexer Wafer Handler ","eng_sikama_indexer.php","",0); Menu4_3_10=new Array("Aqueous Technologies, Corp.","http://www.acrosemi.com/eng_products_Aqueous.php","",8); Menu4_3_10_1=new Array("Defluxing Systems","eng_Aqueous_Defluxing.php","",0,20,200); Menu4_3_10_2=new Array("Stencil Cleaning Systems","eng_Aqueous_Stencil_Cleaning.php","",0); Menu4_3_10_3=new Array("Cleanliness Testers","eng_Aqueous_Cleanliness_Testers.php","",0); Menu4_3_10_4=new Array("Evaporators","eng_Aqueous_Evaporators.php","",0); Menu4_3_10_5=new Array("Accessories","eng_Aqueous_Accessories.php","",0); Menu4_3_10_6=new Array("Spare Parts","http://store.aqueoustech.com/SearchResults.asp?Cat=32","",0); Menu4_3_10_7=new Array("","","menu_div.gif",0,2); Menu4_3_10_8=new Array("Chemicals ","http://www.aqueoustech.com/Chemical_Page.html","",0); Menu4_3_11=new Array("Den-on Instruments Co., Ltd.","http://www.acrosemi.com/eng_products_DIC.php","",2,20,220); Menu4_3_11_1=new Array("Rework System","http://www.acrosemi.com/eng_DIC_SD3000.php","",0,20,170); Menu4_3_11_2=new Array("Rework BGA System","http://www.acrosemi.com/eng_DIC_RD500_2.php","",0); Menu4_3_12=new Array("SST International","http://www.acrosemi.com/eng_products_SST.php","",3); Menu4_3_12_1=new Array("Wafer bonders - Model 3180/3190","eng_SST_wafer_bonders.php","",0,20,250); Menu4_3_12_2=new Array("Vacuum Pressure Furnaces","eng_SST_furnaces.php","",4); Menu4_3_12_2_1=new Array("Table Top Solder Reflow Station - Model 1200","eng_SST_mod1200.php","",0,20,345); Menu4_3_12_2_2=new Array("Vacuum/Pressure Furnace - Model 3130","eng_SST_mod3130.php","",0); Menu4_3_12_2_3=new Array("High Vacuum Furnaces - Model 3140/3150","eng_SST_mod3140.php","",0); Menu4_3_12_2_4=new Array("High Volume Production Furnace - Model PF-2400","eng_SST_mod2400.php","",0); Menu4_3_12_3=new Array("Graphite Machining","eng_SST_graphite.php","",0); Menu4_3_13=new Array("Polaris Electronics Corp.","http://www.acrosemi.com/eng_products_POLARIS.php","",6,20,220); Menu4_3_13_1=new Array("Projection Welders","http://www.acrosemi.com/eng_polaris_prod1.php","",0,20,250); Menu4_3_13_2=new Array("Parallel Seam Sealers","http://www.acrosemi.com/eng_polaris_prod2.php","",0); Menu4_3_13_3=new Array("Spot Welders","http://www.acrosemi.com/eng_polaris_prod3.php","",0); Menu4_3_13_4=new Array("Lid Tacker","http://www.acrosemi.com/eng_polaris_prod4.php","",0); Menu4_3_13_5=new Array("Snap-tite Component Insulators","http://www.acrosemi.com/eng_polaris_prod5.php","",0); Menu4_3_13_6=new Array("Options","http://www.acrosemi.com/eng_polaris_prod6.php","",0); Menu4_3_14=new Array("Accvacs","http://www.acrosemi.com/eng_products_Accvacs.php","",8,20,370); Menu4_3_14_1=new Array("E Series Impulse Sealer","http://www.acrosemi.com/eng_accvacs_id1.php","",0,20,600); Menu4_3_14_2=new Array("E Series Vacuum Sealer","http://www.acrosemi.com/eng_accvacs_id2.php","",0); Menu4_3_14_3=new Array("E Series Vacuum Sealer With Dual Nozzles","http://www.acrosemi.com/eng_accvacs_id3.php","",0); Menu4_3_14_4=new Array("E Series Stainless Steel Vacuum Sealer","http://www.acrosemi.com/eng_accvacs_id4.php","",0); Menu4_3_14_5=new Array("DTS Medial Series Digital Impulse Sealer With Temperature Control","http://www.acrosemi.com/eng_accvacs_id5.php","",0); Menu4_3_14_6=new Array("MTS Medial Series Color Touch Screen Impulse Sealer With Temperature Control","http://www.acrosemi.com/eng_accvacs_id6.php","",0); Menu4_3_14_7=new Array("DTV Medial Series Digital Vacuum Sealer With Temperature Control & Gas Purge","http://www.acrosemi.com/eng_accvacs_id7.php","",0); Menu4_3_14_8=new Array("TSV Medial Series Touch Screen Vacuum Sealer With Temperature Control & Gas Purge","http://www.acrosemi.com/eng_accvacs_id8.php","",0); Menu4_3_15=new Array("DeWeyl Tool Company","http://www.acrosemi.com/eng_products_DeWeyl.php","",11,20,220); Menu4_3_15_1=new Array("Automatic Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod1.php","",0,20,320); Menu4_3_15_2=new Array("Manual Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod2.php","",0); Menu4_3_15_3=new Array("Vertical Feed / Deep Access Tools","http://www.acrosemi.com/eng_deweyl_prod3.php","",0); Menu4_3_15_4=new Array("Ribbon Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod4.php","",0); Menu4_3_15_5=new Array("TAB Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod5.php","",0); Menu4_3_15_6=new Array("Insulated Wire Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod6.php","",0); Menu4_3_15_7=new Array("Large Wire Bonding Tools","http://www.acrosemi.com/eng_deweyl_prod7.php","",0); Menu4_3_15_8=new Array("Micro - BGA tools (Tessera)","http://www.acrosemi.com/eng_deweyl_prod8.php","",0); Menu4_3_15_9=new Array("Hesse & Knipps / Palomar Deep Access Series","http://www.acrosemi.com/eng_deweyl_prod9.php","",0); Menu4_3_15_10=new Array("The A8D Option","http://www.acrosemi.com/eng_deweyl_prod10.php","",0); Menu4_3_15_11=new Array("Tool Options","http://www.acrosemi.com/eng_deweyl_prod11.php","",0); Menu4_3_16=new Array("Neutronix-Quintel, Inc. (N.X.Q.)","http://www.acrosemi.com/eng_products_NXQ.php","",8,20,360); Menu4_3_16_1=new Array("MPA 500 / 600 Series Mask Aligners","eng_NXQ_MPA500_600.php","",0,20,420); Menu4_3_16_2=new Array("PLA 501 Series Mask Aligner","eng_NXQ_PLA501.php","",0); Menu4_3_16_3=new Array("PLA 600 Series Mask Aligner","eng_NXQ_PLA600.php","",0); Menu4_3_16_4=new Array("Q7500 Series Mask Aligner","eng_NXQ_Q7500.php","",0); Menu4_3_16_5=new Array("Q4000-4 Mask Aligner","eng_NXQ_Q4000-4.php","",0); Menu4_3_16_6=new Array("Q4000-6 Mask Aligner","eng_NXQ_Q4000-6.php","",0); Menu4_3_16_7=new Array("Q1200 Flood Expose System","eng_NXQ_Q1200.php","",0); Menu4_3_16_8=new Array("NeuVision² Automated Pattern Recognition Alignment System","eng_NXQ_NeuVision.php","",0); Menu4_3_17=new Array("Vitrox Technologies","http://www.acrosemi.com/eng_products_Vitrox.php","",4,20,220); Menu4_3_17_1=new Array("STATION #1: 2D - Orientation Check","http://www.acrosemi.com/eng_products_vitrox.php#station1","",0,20,280); Menu4_3_17_2=new Array("STATION #2: 2D - Mark/Mark Lead Check","http://www.acrosemi.com/eng_products_vitrox.php#station2","",0); Menu4_3_17_3=new Array("STATION #3: 3D - 3D Lead/5-sided Check","http://www.acrosemi.com/eng_products_vitrox.php#station3","",0); Menu4_3_17_4=new Array("STATION #4: 2D - In-Pocket Check","http://www.acrosemi.com/eng_products_vitrox.php#station4","",0); Menu4_3_18=new Array("Top-A Technology","http://www.acrosemi.com/eng_products_TopA.php","",3,20,220); Menu4_3_18_1=new Array("Semiconductor Equipment from Top-A Technology","http://www.acrosemi.com/eng_topa_semiconductor.php","",0,20,350); Menu4_3_18_2=new Array("LCD/DPD Equipment","http://www.acrosemi.com/eng_topa_lcd_pdp.php","",0); Menu4_3_18_3=new Array("OVEN/CHAMBER","http://www.acrosemi.com/eng_topa_oven_chamber.php","",0); Menu4_3_19=new Array("ETSP - Ovens & Chambers Company","http://www.etsp.co.kr","",0,20,220); Menu5=new Array("APPLICATIONS","http://www.semiprobe.com/applications.php","",17,20,115); Menu5_1=new Array("Wafer & Die Inspection","http://www.semiprobe.com/Die%20Inspection%20Application.php","",0,20,200); Menu5_2=new Array("Device Characterization","http://www.semiprobe.com/Device%20Characterization%20Application.php","",0); Menu5_3=new Array("Discrete Devices","http://www.semiprobe.com/Discrete%20Devices%20Application.php","",0); Menu5_4=new Array("ESD","http://www.semiprobe.com/ESD.php","",0); Menu5_5=new Array("Failure Analysis","http://www.semiprobe.com/Failure%20Analysis%20Application.php","",0); Menu5_6=new Array("HF/Microwave","http://www.semiprobe.com/HF%20Microwave%20Applications.php","",0); Menu5_7=new Array("Known Good Die (KGD)","http://www.semiprobe.com/KGD.php","",0); Menu5_8=new Array("MEMS","http://www.semiprobe.com/MEMS.php","",0); Menu5_9=new Array("Microfluidics","http://www.semiprobe.com/Microfluidics.php","",0); Menu5_10=new Array("Nanotechnology","http://www.semiprobe.com/Nanotechnology.php","",0); Menu5_11=new Array("Optoelectronic","http://www.semiprobe.com/Opto%20Test%20Systems.php","",0); Menu5_12=new Array("Photovoltaic","http://www.semiprobe.com/Photovoltaic%20Applications.php","",0); Menu5_13=new Array("Pin to Pad","http://www.semiprobe.com/Pin%20to%20Pad%20Align%20Application.php","",0); Menu5_14=new Array("PCB & Substrate Testing","http://www.semiprobe.com/PCBs%20and%20Substrates%20Applications.php","",0); Menu5_15=new Array("Silicon Laser Microsurgery","http://www.semiprobe.com/Laser%20Microsurgery.php","",0); Menu5_16=new Array("Vacuum probing","http://www.semiprobe.com/AVP.php","",0); Menu5_17=new Array("Wafer Level Reliability (WLR)","http://www.semiprobe.com/Wafer%20Level%20Reliability%20Applications.php","",0); Menu6=new Array("ARTICLES","http://www.acrosemi.com/english_articles.php","",8,20,138); Menu6_1=new Array("Introduction to Integrated Circuit Technology","http://www.acrosemi.com/pdf/ic_technology.pdf","",0,20,420); Menu6_2=new Array("Semiconductor Manufacturing Processes","http://www.acrosemi.com/technical_files/semi_process.php","",0); Menu6_3=new Array("Versatile Bonder is the Design Key to Attaching Laser Diodes","http://www.acrosemi.com/Articles_Versatile_Bonder.php","",0); Menu6_4=new Array("Bonder Design Meets Telecom Challenges","http://www.acrosemi.com/Articles_Bonder_Design.php","",0); Menu6_5=new Array("Reworking Underfilled Flip Chips","http://www.acrosemi.com/Articles_Reworking_Underfilled_Flip_Chips.php","",0); Menu6_6=new Array("Diode Bonding Evolves to Meet Telecom Demand","http://www.acrosemi.com/Articles_Diode_Bonding.php","",0); Menu6_7=new Array("Gearing up for Flip Chip","http://www.acrosemi.com/Articles_Gearing_up_for_Flip_Chip.php","",0); Menu6_8=new Array("Sticky Issues with Semiconductor Processing Tape","http://www.acrosemi.com/Articles_Semiconductor_Processing_Tape.php","",0); Menu7=new Array("SERVICES","http://www.acrosemi.com/english_services.php","",0,20,138); Menu8=new Array("CONTRACT MANUFACTURING","http://www.acrosemi.com/contract_manufacturing.php","",0,30,238); Menu9=new Array("CONTACT US","http://www.acrosemi.com/english_contact_us.php","",3); Menu9_1=new Array("Contact Information","http://www.acrosemi.com/english_contact_us.php","",0,20,170); Menu9_2=new Array("Online Contact Form","http://www.acrosemi.com/english_online_contact.php","",0); Menu9_3=new Array("Careers at Acrosemi","http://www.acrosemi.com/eng_careers.php","",0);