|
As the exclusive Sales Representative for the
following products in Vietnam, Acrosemi Corporation is
proud to offer a broad range of the world's leading
innovative products and turn-key solutions used in the
development and production of microelectronic devices
for the semiconductor, photonics, hybrid and printed
circuit industries and also for soldering, brazing
and glass sealing of microelectronic packages and components.
Our products have been designed to
meet the highest standards for quality and reliability.
We have equipment ranges from wire bonders, die
bonders, die
attach, epoxy die attach, pull tester, die molding, flip chip die
bonders, wafer bonders, die handling equipment, burn-in & related services, burn-in equipment & boards, wet benches, rework BGA systems, test
equipment, full-line of Surface Mount (SMT) systems, AOI (Automated Optical Inspection) and X-Ray systems, wafer and die tape
to mounting equipment,
a wide range of options for screen printers,
automation equipment for parts handling, vision systems,
in-line IR dryers and screen printing supplies,
a wide range of options for mask aligners, dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation, vacuum sealers,
vacuum pressure furnaces, hermetic sealing systems,
including projection and seam sealer for
microelectronic and optoelectronic packages including
solder-reflow, curing system, TO, butterfly style packages, and all
kinds of Caramic, Tungsten Carbide, and Titanium Wire
Bonding Wedges. , and a wide range selections of Bonding Wires: Au, Al, Pt, Cu, Ribbon.
Select product that includes your application:
|
Top