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West·Bond Products
Choose a Model from the list below or Click on photo to see larger image.
Wire Bonding Machines:
The following machines are designed to use for Wedge-Wedge Wire Bonding, Ball-Wedge Wire Bonding,
or Single-Ball (Security) Bonding.
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Wedge-Wedge Wire Bonding |
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Ball-Wedge Wire Bonding |
Smooth Operator
The world's leading Manual X-Y-Z Micromanipulator
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 Look at the moving hand
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then look at the tool also!  |
Typical Applications
Many Uses Include:
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"D" Series
Model 7476D (Wedge-Wedge Wire Bonder):
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Machines of this series bond aluminum or gold wires from 0.0007 in. to 0.002 in. diameter, gold ribbon 0.0005 in. by 0.002 in. through 0.001 in. by 0.010 in. by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is fed to the work point by two methods selectable by exchange of wire clamps; either diagonally through the heel of the bonding wedge, or vertically down through a hollow wedge. Either allows programmed motions to clamp, break, and feed wire continuously, but requires front-to-back bonding direction. This machine is very easy to use.
 Click here for Specifications.
 Model 7476D Brochure (260 KB)
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Model 7700D (Single Ball or Ball-Wedge Wire Bonder):
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Machines of this series bond gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. The connection is begun with a ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The operator using hand/eye reference to bond targets and elevations guides the bonding tool manually.
Click here for Specifications.
Model 7700D Brochure (271 KB)
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"E" Series
Model 7476E (Wedge-Wedge Wire Bonder):
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The base model of this series is Model 7400E, an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations. This machine is very easy to use.
Click here for Specifications.
Model 7476E Brochure (277 KB)
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Model 7700E (Single Ball or Ball-Wedge Wire Bonder):
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Model 7700E is a thermosonic ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. The connection is begun with a ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations. This machine is very easy to use.
Click here for Specifications.
Model 7700E Brochure (297 KB)
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Model 747676E (Wedge-Wedge and Ball-Wedge Wire Bonders):
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Triple Convertible Machines: Including Model 7476E and Model 7700E. This machine with three bond tool heads, 45° head, 90° head, and ball bonding head, all convertible. This machine is very easy to use.
Click here for Specifications.
Model 747677E Brochure (297 KB)
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An example of a typical amplifier where vertical feed deep access wedge-wedge wire bonding is required
and ribbon interconnects between substrates.
Click here for more information or contact our offices in Vietnam:
© 2008 AcroSemi Corporation. All rights reserved.
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