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Following is a list of West·Bond Manual Die Bonders:

Model

Features/Photos

Specification

Brochure
(pdf)

7200CR - Dual Head Epoxy Die Bonder

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7316C - Single Head Eutectic Die Bonder

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7327C - Single Head Eutectic Die Bonder

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7367E - Eutectic Tweezer Die Bonder

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7372E - Epoxy & Eutectic Die Bonder

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7374E - Beam Lead Bonder

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Manual Die Bonders Short Descriptions:

"C" Series

Model 7200CR (Epoxy Die Bonder):

Model 7200CR provides separate functions on the same tool head to dispense epoxy, then to pick up chips, rotate them into alignment, and place them. All operation is controlled by West·Bond’s unique three axis micromanipulator, working in combination with optical encoders under microprocessor control. The work piece is held on a free anvil work holder, where chips are also arrayed for pick up. This machine is very easy to use.
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Model 7200CR Brochure (284 KB)


Model 7316C (Eutectic Die Bonder):

Model 7316C allows to pick up and place chips and then bond them by the mechanical scrub, eutectic method. All operation is controlled by West·Bond’s unique three-axis micromanipulator under microprocessor control. The work piece is held on a heated work holder, where chips are also arrayed for pick up. This machine is very easy to use.
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Model 7316C Brochure (250 KB)


Model 7327C (Multi-Collet Eutectic Die Bonder):

This machine with a pneumatically operated turret mechanism to rotate into use position a succession of six differently sized die collets. Collets may not be heated. Turret advance to the next position is by a pushbutton switch on the manipulator control. Six sets of values for velocity, distance and number of "Y" axis scrub strokes are entered into buffers associated with the turret tool positions, and so execute a scrub motion program appropriate to each bond tool. This machine is very easy to use.
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Model 7327C Brochure (250 KB)




"E" Series

Model 7367E (Eutectic Tweezer Die Bonder):

This machine with heads for mechanized tweezers pick up and placement of die, and for vacuum pick up and placement of preforms. Tweezers clamping force is set and displayed by an included load cell calibration fixture, to hold the very low values necessary to place fragile die which would be damaged by other handling means. The preform head includes the standard means to rotate preforms at placement. Mechanical scrub motion for the bond head, driven by the transfer motor, is programmable in both amplitude and number of repetitions. Head lift motion is locked out pneumatically during scrub. Bond force is adjusted by a low rate coil spring. This machine is very easy to use.
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Model 7367E Brochure (271 KB)


Model 7372E (Epoxy and Eutectic Die Bonders):

This Dual-Head Die Bonders use the heads alternately to pick up chips; then rotate, place, and bond them. Both pick-up and bonding can be done by different methods, changeable by detachable heads. The machine action to exchange heads places each one in view at the same use position, and by motions that are now also orthogonal rather than pivoted.
The significant advantages of the E-Series – gantry construction to allow unlimited work piece size, orthogonal motions rather than pivoted, individual axis brakes – are brought to West·Bond’s line of Dual-Head Die Bonders by this completely new design. ESD protection is included as an added bonus. This machine is very easy to use.
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Model 7372E Brochure (271 KB)


Model 7374E (Beam Lead Die Bonders):

This machine adapted for ultrasonic bonding, with heat, of the tab leads of beam lead diodes. The right head is used for pick up of the tabbed die with provision for rotation at placement. The left head used for bonding the tabs is equipped with K~Sine Model 46-D Ultrasonic Transducer and with radiant heat to the bond tool. Built-in ultrasonic power supply is K~Sine Part No 6795, four Watts, dual channel. Settings of power and time program values are executed via an eight bit interface. Force is adjustable by force spring through a range of 10 to 175 grams. This machine is very easy to use.
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Model 7374E Brochure (271 KB)


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