access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual "E" Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.
Machines of this series bond gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. The connection is begun with a ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The operator using hand/eye reference to bond targets and elevations guides the bonding tool manually.
for thirty different device types may be entered into separate buffers. Each device wire may have up to 21 stitch bonds with individual ultrasonic power, time, force (high or low) and loop elevation control data. The newest feature, call “Security bond” has been added to machine settings which will help the operator to easily switch between the regualar ball bonding and security ball bonding – if the Security bond option is on, the bonding sequence will be Ball -> Wedge -> Security bond; otherwise, it will be Ball -> Wedge. All program values, action prompts, and fault diagnostics are exhibited on the easy to read 4 line, 40 character LCD sequentially with machine operation.
include programmable dual force (high or low), security bond, pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat. Available with or without the base and work platform for tabletop or conveyor system applications.