West·Bond 7300E Series :: Model 7372E, Model 7367E, and Model 7374E
Model 7372E – Convertible Epoxy / Eutectic Die Bonder
Model 7367E – Dual Head Eutectic Tweezer Die Bonder
Model 7374E – Dual Head Beam Lead Diode Bonder
UNLIMITED DEEP REACH
access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual "E" Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.
MODEL 7372E includes interchangeable tool head assemblies for bonding by either epoxy (near right) or eutectic (far right) methods. Pick-up tool rotation and radiant heat are standard. All programmed bond variables for each tool head assembly are retained in memory, and are retrieved upon conversion.
combines mechanized tweezers for pick-up, placement, and scrubbing of die, with a rotatable vacuum capillary for pick-up and placement of pre-forms. Tweezing is activated pneumatically with the clamping force adjustable to the very low values necessary to pick up and place fragile die that could be damaged by other handling means.
adapted for ultrasonic bonding, with heat of the tab leads of beam lead diodes. The right head, the same as the machines above, is used for pick up of the tabbed die with provision for rotation at placement. The left head (see right) is equipped with K~Sine 46E Ultrasonic transducer and with radiant heat to the bond tool
CONTROL LOGIC: Motorola 68000 Microprocessor
MEMORY: Battery back-up RAM
DATA ENTRY: Selector switch
Z TOOL RANGE: 0.5625 inch
Z ENCODER RESOLUTION: 0.001 inch
WORK PLATFORM: Elevation adjustable through 0.625 inch