West·Bond Semi-Automatic Ball Bonder Model 4730E - High Frequency

 

   

 

   

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Click here to find out more! Model 4730E – Semi-Automatic Single Ball or Ball-Wedge Bonder,
Motorized Z and Y Axes (High Frequency)


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Model 4730E - Single Ball or Ball-Wedge Bonder (High Frequency)

AUTOMATIC PRECISION at a fraction of the cost. Microprocessor controlled motor drives for both Y and Z axes bond a succession of parallel, single or multiple arched wires maintaining identical loop and bond shapes. Unlimited deep-reach access to bond targets on IC packages of any X-Y dimension with West·Bond’s throatless chassis and micromanipulator designs. Ideal for bonding high power, high frequency devices where identical bond and loop shapes are critical.

BOND TOOL HEAD this machine with one bond tool head and EFO assembly for single ball or ball-wedge bonding.

 

PROGRAMMING for different types of wire connections are entered into separate buffers, each with individual ultrasonic power, time, force (high or low) and loop control data. Each type may have up to 100 bonds, and may be repeated for any number of wires for up to a maximum of 6,000 individual bonds. Program values, action prompts and fault diagnostics are exhibited on the easy to read 4 line, 40 charater LCD sequentially with machine operation.

ADDITIONAL FEATURES include 63 kHz ultrasonics, orthogonal X-Y-Z axes with pure vertical Z, color video and microscope targeting, motion slaved Z encoder, pneumatic braking of X-Y-Z axes during bonding, and built-in tool heat. Available with the base and work platform for tabletop applications, or without base and work platform for mounting above any work handling system.



  • CONTROL LOGIC: Motorola 68000 microprocessor
  • MEMORY: 256KB RAM
  • DATA ENTRY: Keypad -12 keys
  • DISPLAY: 4 line, 40 character LCD
  • DEVICE STORAGE: Battery Backup RAM
  • MONITOR: LCD Flat Screen
  • TOOL Z STROKE: 0.5 inch
  • TOOL Y STROKE: 0.5 inch
  • MOTORIZED Z RESOLUTION: 0.000208 inch per micro-step
  • MOTORIZED Y RESOLUTION: 0.000208 inch per micro-step
  • MANUAL Z ENCODER RESOLUTION: 0.001 inch
  • FORCE RANGE: Adjustable, 10-250 grams,
  • BOND FORCE: High / Low Programmable
  • TRANSDUCER: ½ wave, 63 kHz (nominal)
  • ULTRASONICS: Built-in, 8 bit, 5 watts
  • ESD PROTECTION: Protection against Electrostatic Discharge
  • BALL FAULT DETECTION: Ball bonder
  • TAIL AND PULL STROKES: Programmable
  • ANGLED FEED TOOL LENGTH: 0.750 inch
  • VERTICAL FEED TOOL LENGTH: 0.750 inch
  • BALL CAPILLARY LENGTH: 0.625 inch
  • WIRE RANGE: 0.7 to 2 mils, ½ x10 mil gold ribbon (vertical feed)
  • WIRE SPOOL MOUNT: 0.5 inch with ball bearing roller
  • MICROMANIPULATOR: Counterbalanced, single lever X-Y-Z
  • RADIANT TOOL HEAT: Built-in
  • WORK PLATFORM: Fixed height. Adjustable height priced separately
  • MICROSCOPE: Selection available (ESD types available)
  • ILLUMINATOR: Selection available (ESD types available)
  • WORK HOLDERS: Selection available (ESD types available)
  • COMPRESSED AIR: Regulated to 50 psig, is required. Connection is via 1/4-inch tubing
  • ELECTRICITY: 50-60 Hz, single phase, either 115 VAC or 230 VAC
  • DIMENSION: W=24.218" D=22.297" H=11.000" (exclusive of microscope, or H=15.000" to scope eyepieces)
  • WEIGHT: 75 lbs uncreated, or 165 lbs accessorized and crated

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