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vietnam semiconductor company
vietnam leading supplier of semiconductor
vietnam semiconductor manufacturing
vietnam microelectronics company, industry
vietnam tradeshow,vietnam outsourcing
vietnam electronic contract manufacturing
semicon vietnam, world best, world leading
vietnam semiconductor forecast
vietnam photovoltaic, solar cell
vietnam Surface Mount Assembly, smt,clean room
vietnam Nanotech, MEMS Assembly
vietnam smt, probe station
world’s fastest wire bonder, die bonder
material handling equipment
intel wire die bonder
ic chip packaging, backend assembly
dicing saws, dicing tools, laser scribing
complete dicing solution
nepcon vietnam, optoelectronics, vietnam opto
smt equipment, PCB assembly equipment
turnkey-equipment solutions
semiconductor equipment
RFID,Hybrids,IC,
Photonics,RF,MEMS
We offer a wide range of products, turn-key solutions and services that cover your needs in the semiconductor industry. Click here for more information!

Acrosemi Corporation draws upon 40 years of experience to offer a broad range of the world's leading innovative products and turn-key solutions used in the development and production of microelectronic devices for the semiconductor, photonics, hybrid, microlithography, surface mount techonology (SMT) and printed circuit industries, dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation, and also for soldering, brazing and glass sealing of microelectronic packages and components. A complete line of Manual Wire and Die Bonding, Semi-Automatic, and Automatic Wire Bonding Machines is also available. They are modularly designed for maximum process flexibility, yet are simply designed for reliable, continuous operation. We specialize in providing sales selection advice and trial, and after-sale installation, support and service for all of our equipment.

In addition, we can also assist in Turnkey Solutions for:

Click here for more information.

  • Surface Mount Assembly and Test Production Line.

  • Microwave, Hybrid Assembly, and Test Production Line.

  • Nanotech, MEMS Assembly, and Test Production Line.

  • Photonics, IC, RF Assembly, and Test Production Line.

  • Thick/Thin Film Assembly Line.
  • MEMS Package Sealing Line.
  • Hermetic Package Sealing Line.
  • Full range of Microelectronics Test, Assembly, and Packaging Line.
  • Full range of Dicing Solutions.

West·Bond Manual Wire BonderManual Wire Bonding (close up photo, bonding wire size is 25.4 microns)
Smooth Operator
(Look at the moving hand - then look at the tool)
Manual Die Bonders | Manual Wire Bonders | Semi-Automatic Wire Bonders |
Automatic Wire Bonders | Pull Test Machines | More ...


 Why Acrosemi
Turnkey solutions
Best delivery and best    customer service
Easy-to-use and out-of-   the-box products
Faster, more reliable and    expandable solutions
Dedicated support    department


 News / Events
Acrosemi - As seen on TV
See VIDEOs!
VIETNAM OPTO 2008
November 28, 2008
Ho Chi Minh City, Vietnam

AUTOMA VIETNAM 2008
September 27-30, 2008
Hours: 09h00 – 17h00
Vietnam Exhibition Fair Centre – 148 Giang Vo Road, Hanoi, Vietnam
(Visit us at Booth #132)

Vietnam Technology Business Mixer (VTBM)
May 10, 2008
Sumerset Hotel, Vietnam
www.smtvietnam.com
Click here to view more photos.
VTBM Photos Gallery:
Click here to view more photos!
NEPCON VIETNAM 2008
May 8-10, 2008
Hanoi International Center for Exhibition (I.C.E.)
Cultural Palace Hanoi, Vietnam. (Booth No. C19)
www.nepconvietnam.com

ECIT 2007
October 12-15, 2007
Phu Tho Sport Centre
01 Lu Gia, District 11,
Ho Chi Minh City, Vietnam
(Booth No. 7, 8, 9 & 58, 59, 60)
Click here to view larger image. E-News
TechMart Hanoi 2007
July 19-22, 2007
Vietnam Exhibition Fair
148 Giang Vo,
Hanoi, Vietnam
(Booth No. 123)
Hon Hai Reported to Raise Investment in Vietnam to $5 Billion USD
Hon Hai to Invest $1 Billion USD in Vietnam
Vietnam's WTO
Intel Expands Investment in Vietnam
Our Suppliers:
West·Bond manufactures wire bonders, die bonders, die attach, epoxy die attach, and pull tester for the semiconductor industry. Levels of automation vary from completely manual to fully automatic. Click here for more information. Semiconductor Equipment Corporation (SEC) manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment. Click here for more information. Polaris Electronics Corp. offers projection welders and parallel seam sealers for microelectronic and optoelectronic packages, as well as spot welders, lid tackers and other, optional accessories designed to meet every hermetic sealing need. Click here for more information.
DeWeyl Tool, Inc. provides the finest quality bonding wedges in the world. DeWeyl's primary business is manufacturing wirebond wedges, die pickup tools, and Custom high precision tooling for the Semiconductor, Aerospace, and Medical Industry. DeWeyl produces wedges made from ceramic, titanium, and tungsten carbide used in bonding Aluminum, Gold, Copper, and Platinum wires. Click here for more information. Affiliated Manufacturers, Inc. (AMI) offers a wide range of options for screen and stencil printers, automation equipment for parts handling, vision systems, in-line IR dryers and screen printing supplies. Click here for more information. Neutronix-Quintel (NXQ) offers a wide selection of mask aligners and automated pattern recognition alignment system. Click here for more information. SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. Products include Wafer Bonders, Vacuum/Pressure Furnaces, and Graphite Machining Services. Click here for more information. YESTech, Inc. is a leading global provider of automated optical inspection (AOI) and high-resolution X-ray inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the printed circuit board assembly, advanced semiconductor-packaging and hybrid assembly to EMS providers and electronics OEM's worldwide. Click here for more information. With over 25 years of experience in the Surface Mount Technology (SMT) industry, Samsung Techwin Co. Ltd. (an integral part of Samsung) is the world's best known company for their complete line of SMT assemblers and accessories to support your needs. Levels of automation vary from low-, medium-, to high-volume products. Their extensive knowledge in installation and servicing equipments, as well as their superior customer service level, has earned them the most reputable company. For this reason, many of the world's largest subcontractors use Samsung SMT machines for their flexibility production and service requirements. Click here for more information.
Accvacs is a manufacturer of Digital Table Top Impulse & Vacuum Heat Sealers. Our Impulse & Vacuum Sealers are Manufactured in the USA with the most Advanced Electronic & Pneumatic Controls which allows us to offer our customers the best Safety options, the best Seal and the best Warranty in the Industry. Click here for more information. Universal (Far East) Pte Ltd, parent company is Trio-Tech International Inc., has more than twenty years of experience in the distribution of test and manufacturing equipment used in a wide range of industries including semiconductor, electrical and electronics and manufacturing. Click here for more information. A Global Test and Manufacturing Solutions company. Founded in 1958, Trio-Tech International designs, develops and manufactures equipment used in the manufacturing and testing of wafers, devices and other electrical components. Click here for more information.
Advanced Dicing Technologies (ADT) is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation. Combining our dicing equipment and annular dicing blades, we bring our customers a complete range of dicing solutions. Click here for more information. Vitrox Technologies, innovating vision, is committed to providing the most innovative, advanced and cost effective machine vision solution of excellent quality to our customers through integration of our technology, our people and our strategic alliances. Click here for more information.
Copyright © 2006-2008 AcroSemi Corporation. All rights reserved.
The Chip Making Process