Temperature and Pressurization Test System
Suitable for semiconductors application that requires curing and bonding of test samples. Other application of Autoclave testing, please feel to contact us.
Specifications
- Temperature Range : Up to 180 º C
- Pressure Range : Up to 100 Psig
- Chamber Volume: 9 to 160 Liters
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Temperature and Pressure Pulsation Test System
Pulse Pressure Temperature Control Chamber System, designed to process any chips that requires various setting parameters (eg. Temperature, pressure and other required parameters etc.).
Specifications
- Temperature Range : 70 to 140 º C
- Pressure Range : Up to 50 Psig
- Chamber Volume: 9 to 160 Litres
- Pulse Width Range : 2 to 59 Seconds
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Components Leak Detection System
Suitable for semiconductors application that requires testing for hermetic sealed by detecting leakages of the sealed ICs. These equipments can be applicable for semiconductor or defence industry that requires high degree of quality in IC components.
Gross and Fine Leak Pressurization Test Equipment Specs
- Vacuum Range : 0.5 to 5 Torr
- Pressure Range : 20 to 125 Psia
- Chamber Volume: 7 to 25 Liters
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Bubble Tester Specs
- Temperature Range : 50 to 145 º C
- Chamber Volume: 3 to 12 Liters
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Temperature and Humidity Test System
Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts.
Specifications
- Temperature Range : -70 to 180 º C
- Humidity Range : 10 to 98 % R.H
- Chamber Volume: 50 to 1500 Liters
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Temperature, Humidity and Pressure Test System
To evaluate the reliability of plastic encapsulated ICs and other microelectronics devices in humid environments. It employs severe conditions of temperature, humidity, bias or un-bias which accelerate the penetration of moisture through the external protective material (encapsulates or seal).
Specifications
- Temperature Range : 105 to 150 º C
- Humidity Range : 50 to 100 % R.H
- Chamber Volume: 60 to 160 Liters
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Thermal Shock Test System
Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts.
Specifications
- Temperature Range : -80 to 200 º C
- Chamber Volume: 32 / 130 / 350 Liters
- No. of Cycles: 3000 Cycles
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