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Temperature Testing Systems

Universal's laboratory is qualified to the ISO/IEC 17025 Accredited Test and Calibration standards. For more information, please contact us.

Temperature and Pressurization Test System

Suitable for semiconductors application that requires curing and bonding of test samples. Other application of Autoclave testing, please feel to contact us.

Specifications
  • Temperature Range : Up to 180 º C
  • Pressure Range : Up to 100 Psig
  • Chamber Volume: 9 to 160 Liters
Temperature and Pressure Pulsation Test System

Pulse Pressure Temperature Control Chamber System, designed to process any chips that requires various setting parameters (eg. Temperature, pressure and other required parameters etc.).

Specifications
  • Temperature Range : 70 to 140 º C
  • Pressure Range : Up to 50 Psig
  • Chamber Volume: 9 to 160 Litres
  • Pulse Width Range : 2 to 59 Seconds
Components Leak Detection System

Suitable for semiconductors application that requires testing for hermetic sealed by detecting leakages of the sealed ICs. These equipments can be applicable for semiconductor or defence industry that requires high degree of quality in IC components.

Gross and Fine Leak Pressurization Test Equipment Specs
  • Vacuum Range : 0.5 to 5 Torr
  • Pressure Range : 20 to 125 Psia
  • Chamber Volume: 7 to 25 Liters

 

Bubble Tester Specs
  • Temperature Range : 50 to 145 º C
  • Chamber Volume: 3 to 12 Liters

 

Temperature and Humidity Test System

Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts.

Specifications
  • Temperature Range : -70 to 180 º C
  • Humidity Range : 10 to 98 % R.H
  • Chamber Volume: 50 to 1500 Liters

 

 

Temperature, Humidity and Pressure Test System

To evaluate the reliability of plastic encapsulated ICs and other microelectronics devices in humid environments. It employs severe conditions of temperature, humidity, bias or un-bias which accelerate the penetration of moisture through the external protective material (encapsulates or seal).

Specifications
  • Temperature Range : 105 to 150 º C
  • Humidity Range : 50 to 100 % R.H
  • Chamber Volume: 60 to 160 Liters

 

 

 

Thermal Shock Test System

Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts.

Specifications
  • Temperature Range : -80 to 200 º C
  • Chamber Volume: 32 / 130 / 350 Liters
  • No. of Cycles: 3000 Cycles

 

 

For products and sales enquiries, please contact us.


Click here for more information or contact our offices in Vietnam:
Ho Chi Minh Office
Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
Hanoi Office
Phone: +84(0) 91-225-7173
Email:
hanoi@acrosemi.com

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