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Overview


Sikama International has developed a new line of reflow solder systems known as the Falcon 8000 Series. Incorporating Sikama's unique "thermal technology" based on conduction heating in combination with forced thermal convection, the 8000 Series consists of the 8100 (10 heat zones) and the 8500 (5 heat zones). Each system includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines.

Prior to entering the heated zones, the temperature of the substrates is stabilized by virtue of the liquid-cooled load zone(s). Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/- 2°C to ensure consistent and precise temperatures for reliable, repeatable profiles. The gas is introduced through tiny perforations in the conduction heating platens and enters the reflow chamber at the same temperature as the platens. The internal liquid-cooled zone(s) ensure a process cooldown in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone. Both systems can be supplied to operate left to right or right to left (specify at time of ordering). The Falcon 8000 Series reflow systems feature a unique optional robotic unload capability to complete reflow of parts in process in the event of a downstream equipment failure and off-load the saved substrates onto a tray. These parts can then be manually placed back into the production cycle when the automated line resumes.


The system can be interfaced with a computer (customer supplied) for storing of profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. A tray to accommodate a laptop computer is supplied. Sikama offers an optional Windows® based software package for use with the Falcon systems. KIC Prophet™ thermocouple installation is available as optional equipment (does not include the KIC Prophet system itself).


The Falcon 8100 is ideal for applications involving large ceramic substrates requiring progressive ramp up and ramp down reflow profiles and enables a variety of custom reflow profiles due to the versatility resulting from having ten individually controlled heating zones.


The Falcon 8500 is well suited for wafer bumping applications (3-8 inch diameter wafers) as well as accommodating a broad range of substrate materials, high mass components and fixtures. In addition, the Falcon 8000 reflow systems, also excellent for curing epoxies, are powerful, highly efficient, cost effective systems with high production capabilities and are designed to minimize your initial capital outlay and production costs, increase yields, safeguard your product integrity and improve your bottom line.


PDF Falcon 8500 Datasheet (948 KB)
PDF Walking Beam Datasheet (868 KB)


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Falcon 5x5 Conduction System
Falcon 8 Reflow/Curing Series
Falcon 1200 Reflow Solder/Curing System
Falcon 8500 Reflow Solder/Curing System
Falcon Ultra Profile 2000
Falcon Ultra Profile 4000
Falcon Inline Coating System (ICS) 412
Indexer Wafer Handler



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