| Substrate Materials |
Ceramic, Glass/Epoxy, Paperbased Phenolic, Flex Circuits, "Green Tape", Silicon Wafers and Porcelainized Metals |
| Substrate Size |
5 x 5.5 in. (13x14 cm.) |
| Temperature |
From Room Temperature to 420°C in 2°C
Steps (Higher if Desired) |
| Heating Zones |
3,4, or 5 (Individually Controlled) |
| Processing Modes |
Time or Speed |
| Speed Modes |
0-50 in./minute (0-127 cm./minute) |
| Time Modes |
1-60 minutes/zone
1-60 seconds/zone |
| Carrier or Substrate Size |
5 X 5.5 in. (13 x 14 cm) |
| Heating Zones |
5 Max. |
4 |
3 |
| Cooling Zones |
1 Min. |
3 |
2 |
| Loading Zones |
0 |
1 |
1 |
| Parts Flow |
Either Direction (selected at purchase) |
| Alarm Temperature |
10°C Above/Below Set Point |
| Alarm |
When stopped or jammed |
| Input/Output to Computer |
Through RS 232 port |
| Power |
208/230 V, Single or 3 Phase
50-60 Hz, 4000Watts |
| Warm-Up |
20 minutes to 300°C |
| Zone Size |
5 x 6.5 in. (13 x 16.5 cm.) |
| Cooling Zones |
Cooling by fan (Water cooling also available) |
| Size |
45 in. (114.3 cm.) L x 18 in. (46 cm.) W x 4.3 in. (11 cm.) H |
| Weight |
Approx. 75 lbs. (34 kg.) |
| Warranty |
One year |
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