TIẾNG VIỆT | ENGLISH

Home Products S.E.C. Products

S.E.C. Model 860 Eagle Omni Die Bonder





Semiconductor Equipment Corporation's New Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation. The Eagle's base platform includes a retractable cube beam splitter viewing system with LED lighting, precision servo-driven Z motion with closed loop bond load control, closed loop temperature controls for head, stage and spot heating and Windows XP Pro operating system. Various standard heads and stages are available.

Click here to watch our S.E.C Model 860 in action! (1.7 MB)


Standard Features of S.E.C. Model 860

Two Bond Ranges

Precision servo-motor driven Z motion with the option of choosing from 2 closed loop bond control ranges from 5 grams to 10 kilograms; your choice of one range per configuration.

Viewing System

Extend-retract cube beam splitter viewing system with fiber optic illuminators including color CCD video camera; 14" monitor with a magnification range of 20X to 200X.

Operator Settings

Simplified flat panel display for viewing the cycle and prompting operator action via joystick as process proceeds, providing time and temperature readouts. Internal PC for controlling bond load, temperature profiles, process times and machine cycle. Hard drive and 3.5" floppy disk drive included.

Workstage (3 options available)

Micrometer adjusted workstage holder for movement over either a small or large open area in X, Y and theta during pickup; easily detachable, modular workstage not included – choose from a 1-1/2" rapid (to 400 degrees C) heat-up stage for small substrates, a 4" preset fixed stage (to maximum of 350 degrees C) for large area heating, or a cold, unheated 4" stage.

Workchuck

4" square work chuck with vacuum hold down for either fixed heat or unheated stage or a 3/4" square flat vacuum chuck for rapid heat-up; custom work chucks available.

Bonding

Thermocompression bond head with fixed pick-up tool for operation from cold temperature up to 250 degrees C; includes temperature ramping feature (for adhesive applications) during placement process.


Options for S.E.C. Model 860

For Flip Chip Applications:

  • Thermocompression bond head with temperatures up to 250 degrees C operation.

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.

  • Dual nozzle hot gas spot heating system for localized heating.

  • Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.

For Bonding Edge Emitting Laser Diodes:

  • Rapid heat-up stage.

  • Dual tool bond head consisting of one heated die tool and one preform tool.

  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.

  • Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.

  • Single nozzle hot gas heating system for localized heating.

Eutectic Die Bonding:

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.

  • Dual tool bond head consisting of one heated die tool and one preform tool.

  • Dual nozzle hot gas spot heating system for localized heating.

  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.


Specifications for S.E.C. Model 860

  • +/- 5 micron placement accuracy.
  • Die sizes from 0.006" square to 1.00"
  • Four 2"X2" or 4"X4" waffle pack pick-up stage.
  • Workstage options include 4"X4" cold stage, 4"X4" heated stage or 3/4" rapid heat-up stage.
  • Bond load ranges from 5 grams to 10 kilograms.
  • Throughput - up to 200 placements per hour.

 

Utilities

Compressed air:

60 psi

Vacuum:

20 " Hg

Cover Gas:

40 psi

Power:

110V, 10 amp - 50-60 Hz
220V, 15 amp - 50-60 Hz

Size:

40 " W x 36 " D x 36 " H

Weight:

System - 500 lbs; Shipping - 600 lbs.

Top


Click here for more information or contact our offices in Vietnam:
Ho Chi Minh Office
Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
Hanoi Office
Phone: +84(0) 91-225-7173
Email:
hanoi@acrosemi.com

© 2006-2010 AcroSemi Corporation. All rights reserved.