Semiconductor Equipment Corporation's Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.
The S.E.C. Model 430 Hot Gas Jet Module uses heated gas to heat a single die to reflow. Its closed loop temperature control and gas flow control are integrated with the operation of the S.E.C. Model 850. This unit may be purchased as a field upgrade.
The heated stage is capable of 250º C operation. It incorporates a separate control box with its own closed loop temperature controls. This unit may be purchased as a field upgrade.
Fluxing Station (optional)
The system includes a fluxing tray to dip the die into flux or adhesive prior to placement. The fluxing station can be added as a field upgrade.
A flux tray and doctor blade are used to apply a controlled and uniform thickness of flux.
Die are picked up from waffle packs.
S.E.C. Model 430 Hot Gas Jet Module deliver heated gas to the die in order to reflow a single die without affecting nearby components.