The Model 830 is a general purpose pick and place system for die and surface mount components. The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages. A footswitch option controls the pick - up head to lower the pickup tool to working height and return it home. Open frame design assures full visiblilty and complete access of all system components. Operator friendly - takes less than two minutes to learn to operate. Epoxy die bonding capability can be easily added. The 830 works with any tape - mounted die removal system, including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches.