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S.E.C. Model 830 Pick and Place System


The Model 830 is a general purpose pick and place system for die and surface mount components. The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages. A footswitch option controls the pick - up head to lower the pickup tool to working height and return it home. Open frame design assures full visiblilty and complete access of all system components. Operator friendly - takes less than two minutes to learn to operate. Epoxy die bonding capability can be easily added. The 830 works with any tape - mounted die removal system, including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches.

Click here to watch our S.E.C Model 830 in action! (1.5 MB)


Options for S.E.C. Model 830


  • Die tray pedestal capable of holding up to four 2" X 2" waffle packs.

  • Semiautomatic Z motion.

  • Flat vacuum chuck capable of holding up to four 2" X 2" waffle packs.

  • Stereo zoom microscope and/or projected image cross hair system.

  • High intensity illuminators.

  • Dual position pivoting head for epoxy dispensing.


Specifications for S.E.C. Model 830

  • Plus or minus 25 micron placement accuracy.
  • Four 2" X 2" waffle pack pickup stage available.
  • Four inch square vacuum stage standard (optional sizes available).
  • Consistent bond load.
  • Throughput - up to 400 placements per hour.

 

Utilities

Vacuum:

20 " Hg

Power:

120 VAC 1 amp or 220 VAC 1 amp

Size:

26" W X 18" D X 18" H

Weight:

35 lbs



Click here for more information or contact our offices in Vietnam:
Ho Chi Minh Office
Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
Hanoi Office
Phone: +84(0) 91-225-7173
Email:
hanoi@acrosemi.com

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