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Tape for Semiconductor Wafer Dicing
and Hybrid Substrate Sawing
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For nearly 30 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing. |
Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.
Low Tack -
Blue
Specific Uses - Sawing wafers with larger die sizes. Adhesion is high enough to hold
die firmly during sawing, but low enough for die to be easily removed by die
bonders or pick & place equipment.
Medium
Tack - Blue
Specific Uses - Sawing silicon wafers with smaller die sizes. Adhesion
level is slightly greater than Low Tack-Blue to more firmly hold die to
tape but low enough to easily remove die in the next operation.
Thick
Low Tack - Clear
Specific Uses - Harder to cut materials generally require thicker saw blades and will
require thicker tape. Same adhesion level as Low Tack
Blue.
Thick Medium Tack - Clear
Specific Uses - Harder to cut materials generally require thicker saw blades and will
require thicker tape. Same adhesion level as Medium Tack
Blue.
Low Tack -
Clear
Specific Uses - Sawing silicon wafers where a thicker tape than Low
Tack-Blue is required with the same adhesion level.
Squares
Specific Uses
- A handy way to dispense tape for users without
tape handling equipment. Also ideal for use with interlocking
rings.
Inkjet
Cover Tape
Specific Uses - applied to seal the ink cartridge against ink leakage
during storage and transportation.
UV Curable Dicing Tape |
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Very high adhesive strength
secures wafers firmly during dicing, while allowing for easy removal after exposure. |
P/N 24213
Low Tack, expandable PVC, 80 um thick P/N 24216 Extra High Tack,
non-expandable Polyethylene, 90 um thick P/N 24339 Super High
Tack, expandable PVC, 85 um
thick Our most popular UV tape P/N 24351 Super High Tack, expandable Polyolefin, 170 um
thick
Great for dicing BGA
& ceramic |
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High Purity Pressure Sensitive Expandable Tape with Liner
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Low ionic
impurities and adhesion stability make this the perfect tape for your
clean room application. |
P/N 24202 Low Tack, 80 um thick P/N
24203 Medium Tack, 80 um thick P/N 24204 High Tack, 80 um thick
P/N 24205 Low Tack, stable over time, 75 um thick P/N 24206
Medium Tack, stable over time, 75 um thick P/N 24207 Low Tack, stable
over time, 110 um thick P/N 24208 Medium Tack, stable over time, 110
um thick P/N 24209 Low Tack, 155 um thick P/N 24211 High Tack, 155
um thick
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