A specially designed system to allow die to be loosened for quick and safe removal from plastic wafer mounting tape. Eliminate the need for ejector pins or pokers which can break die as they are being ejected from the tack on the tape.
A complete system includes a Die Ejector Grid (for .040 x .040 and larger die) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.
In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ringmounting sets.