Hot Gas Rework Station Removes Surface Mounted Components And Bonded Die
Using carefully regulated heat controls, quickly and
easily removes surface mounted components and bonded die from PC boards,
hybrid micro-circuits and packages without disturbing nearby components or
damaging the removed device.
For more information about using this technique, please click here.
Bonded die or surface mounted components
can be removed with this versatile rework station. Rework can be accomplished
without disturbing nearby components or damaging the removed device. Removal
heat is applied through an interchangeable nozzle. All process parameters are
closely controlled. The versatility of this unit makes it ideal for removing
surface mounted components such as leadless chip carriers, eutectic bonded die
and epoxy bonded die.
Hot gas jet directs heated nitrogen
through an interchangeable nozzle to the selected area on the
Idle heat and nitrogen flow through the
hot gas jet minimize heater warm up time.
A voltage proportioning temperature
controller monitors the gas temperature at the nozzle and controls it within a
Gas temperature is adjustable to 800 º
Gas flow is adjustable. Flow indicator
is mounted on the control panel.
Heated work holder eliminates thermal
shock and prevents substrate cracking. Temperature controller with digital
readout adjustable to 350 º C controls workholder temperature.
Interchangeable work chuck mounts on
workholder to adapt to various package configurations.
Position lock feature holds work holder
firmly while hot gas is actuated. Position lock override provided.
Push button and parallel foot pedal
operation to increase nitrogen flow and temperature from idle to the amount
required for die removal. Also actuates work holder position lock.
Pressure interlock in nitrogen supply
line prevents a low pressure burnout of heater element.
One half inch Z motion (vertical travel)
manually controlled to permit nozzle to reach into deep packages.
Nozzle height can be adjusted 1.5" to
give a total range (combined with Z motion) of 2".
Stereo Zoom Microscope with 10x eyepieces,
including stationary arm and mounting bracket.
Microscope mounting bracket (required for customer
Rear mounted microscope mounting bracket (required
for large P.C. board rework), and .5x lens.
Illuminator with mounting bracket.
An optional mechanical side mounted device ejector
is available to aide the operator in applying a steady pressure against the
device. The stage is locked in position and a thumbwheel is rotated to bring
the ejector down and then against the side of the device to push it loose.
This option gives more precise control for applications where the die are very
small or very closely spaced. The possibility of overtravel is eliminated and
the visibility of the removal operation is improved.
Work chuck (mounts on work holder) for up to 2" x
2" flat devices.
Additional heated workholder (includes 2" x 2"
Special work chuck.
Recommended Spare Parts Kit.
Additional hot gas jet
nozzles. Includes quartz nozzle with thermocouple port (does not include
The following is a list of quartz nozzles that are
currently available for the "Model 450 Hot Gas Rework Station ." Other sizes
available upon request. To order a custom nozzle, refer to the Custom Nozzle Ordering