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S.E.C. Model 3200 and 3250 Wafer/Backlap Applicator

Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Adjustable roller pressure Cuts tape within .005 " of edge of wafer

Step by Step Procedure, S.E.C. Model 3200 Back Lap Tape Applicator

Quickly, Easily and Uniformly Mounts Protective
Tape to Wafer for Back Lap Operation

	Step #1 Grasp tape from storage position. Pull over wafer mounting platen.
	Step #2 Affix tape to tensioner frame.
	Step #3 Roll tape with preset tension across wafer for bubble-free application.
	Step #4 Close cutter cover.
	Step #5 Separate tape from roll, using built-in slitter.
	Step #6 Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame.
	Step #7 Remove finished wafer assembly.

Features of S.E.C. Model 3200

• Up to 6" wafer capability standard.
• Trims tape to the edge of the wafer including the flats, within .005".
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.
• Manual.

Features of S.E.C. Model 3250

• Four, five, six and eight inch wafer capability standard.
• Trims tape to the edge of the wafer including the flats, within .005 ".
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.
• Manual.

S.E.C. Model 3250 Back Lap Tape Remover Semiconductor Equipment Corp. has introduced a back lap tape remover to compliment it's Model 3250 Back Lap Tape Applicator giving it the ability to double as both an applicator and remover. The tape applicator applies back lapping tape to the top side of a wafer to offer protection during the backside grinding process. Once the wafer is thinned the tape is gently peeled off the wafer while being held by a slip on vacuum chuck that drops onto the tape applicator. The new system works for all size wafers up to 200 mm.

Options for S.E.C. Model 3200 and 3250

• Static Eliminator with power supply.
• Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C. 

Spare Parts for S.E.C. Model 3200 and 3250

• Spare Blades, End Cut, P/N 19190
• Spare Blades, Rotary, Wafer Trimmer

Specifications for S.E.C. Model 3200 and 3250