Corporation's wafer/film tape applicator provides users with the optimal
control of temperature and pressure for achieving uniform bubble-free
mounting of electronic grade processing tape onto wafers and their film
frames for subsequent cutting of wafers into die. The Model 300 is
specifically designed for 300mm wafers.
Bubble Free Tape
With vacuum holding the wafer in position,
a captive roller travels from the front of the applicator along fixed guide
rails over the wafer and film frame in a manner which eliminates any chance of
entrapped pockets of air being formed between the tape and wafer which could
create areas of low or no adhesion.
Even X-Y Directional Tape
A pressure tensioning frame stretches and
holds the tape uniformly in all directions while the tape is rolled into contact
against the wafer and film frame.
Adjustable, Repeatable Contact
The captive roller is coupled with an
adjustable spring loaded platen to deliver the repeatable mounting pressure that
is so important for achieving consistent wafer application.
A digital closed loop temperature
controller regulates the mounting temperature to ensure repeatable
Safe Accurate Tape
A built-in rotary cutter offers
exceptional operating life and quickly, safely and accurately trims the tape
away from the tension frame. The blade automatically retracts safely when not in
Compatible With All Standard Film
Universal design allows any standard frame
to be accurately positioned against locating pins. Magnets hold the frame in
When it is not desirable for the face of
the wafer to come into contact with the platen, an optional non-contact platen
is available. With this option, the wafer is held in position by vacuum along a
narrow ridge around the wafer's perimeter. A pressure backup supports the wafer
during the tape application. The majority of the wafer remains untouched.
Optional Static Eliminator
Located in the tape path, this device
prevents static electricity from building up in the tape.
Model 300 Wafer / Film Frame Applicator comes with
the following standard features:
Up to 12"
wafer capability standard.
Accepts all film
frames (specify type and size).
standard or interleaved tape.
Vacuum stage wafer
Heated vacuum stage
adjustable to 60 degrees C. maximum.
Built in cutter
tape separation systems.
assembly assures consistent wafer / film frame contact pressure.
loaded platen for optimum contact pressure.
anodized chuck for 300mm wafers or
chuck for thin wafers to minimize stress during application.
with power supply.
assembly with the following features:
Non-contact anodized chuck.
to support wafer during tape application.
remove back-up pressure when tape roller is off the
regulator to maintain correct back-up pressure.
tape applicator. A flexible blade follows wafer contour. Best for thin wafers
used with the non-contact chuck.
||120 lbs. |
||180 lbs. |
|Voltage: 110 or 220
VAC-50/60 Hz - Vacuum: 25" H2 - Current: 3
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