- High Speed Bonding,
32,000DPH(Dot/Hr)
- dispensing Accuracy :
±0.1mm (3)
- High Speed Dotting with
2 Spindle Bonding Heads
- High Accuracy Bonding by
a Fiducial Vision Camera
- Precise Measurement of the
Height of the Nozzle
on Z-axis by Laser Sensor
(Option)
- Handles the largest PCB
[510mm(L)×460mm(W)]
among the series of
DP models
- Handles 1608Chip ~ SOP,
QFP
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