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- High Speed Bonding, 32,000DPH
(Dot/Hr)
- dispensing Accuracy : ±0.1mm (3)
- High Speed Dotting with 2 Spindle
Bonding Heads
- High Accuracy Bonding by a Fiducial
Vision Camera
- precise Measurement of the Height
of the Nozzle on Z-axis by Laser Sensor
(Option)
- Handles the largest PCB
[510mm(L)×460mm(W)]
among the series of DP models
- Handles 1608Chip ~ SOP, QFP
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* High Speed Bonding, 32,000DPH(Dot/Hr)
* dispensing Accuracy : ±0.1mm (3σ)
* High Speed Dotting with 2 Spindle Bonding Heads
* High Accuracy Bonding by a Fiducial Vision Camera
* precise Measurement of the Height of the Nozzle on Z-axis by Laser Sensor(Option)
* Handles the largest PCB [510mm(L)×460mm(W)] among the series of DP models
* Handles 1608Chip ~ SOP, QFP |
 High Speed Bonding with 2 Modular Heads |
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The modular spindle heads, integrated with 2 Z-axis and R-axis, enable high-speed operation up to 0.11 sce/dot.
The fiducial vision unit ensures high accuracy and reliability [±0.11mm(3σ)] |
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| Control System for Uniform Bond Discharge |
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The time pressure type head enables constant dotting regardless of the remaining amount of bond by controlling the discharge pressure.
The two cartridge heaters with a temperature range of 25℃~50℃(±1℃) which can be controlled independently,allow the bond discharge to be uniform depending on the viscosity change.
- Capacity of the Applied Syringe : 5㏄~50㏄ |
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| Precise Z-axis Control by Laser Sensor (Option) |
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The laser sensor is able to measure the height of the nozzle without contact, which in turn ensures stable and accurate bonding work even with deflected PCBs. |
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| Special Dotting Nozzle |
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The specially designed dotting nozzle made of stainless steel ensures high quality bonding.
- 2 Dot Nozzle : 1608 Chip ~ 3216 Chip
- 1 Dot Nozzle : 1608 Chip ~ SOP, QFP |
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| Easy Cleaning & Maintenance |
| The manifold type pump head kit that is easy to assemble and dissemble makes cleaning and maintenance simple. |
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| Unique X-Y Frame Structure Design Improving Work Efficiency. |
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- The conveyor designed to move in a Y-axis direction enables more efficient bonding work.
- The high rigidity frame structrue that is the same as that of a chip mounter ensures more stable bonding work.
- The automatic width adjustable conveyor enables easier bonding work(Option).
- Adequate space designed to handle a lange PCB(L510×W460)
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| Rated Power Suply |
Power 2.5Kw |
| Power Supply |
AC110/220V, Single Phase(50Hz/60Hz) |
| Supplied Air Source |
Air Pressure 5Kg/㎠ 20ℓ/min |
| Dimensions(mm) 1,520(L) x 1,385(W) x 1,300(H) |
1,520(L) x 1,385(W) x 1,300(H) |
| Weight(kg) |
approx. 1,300 |
| Conveyor Direction |
Left→Right (Right→Left) |
| Conveyor Rail Fixed |
Front Rail |
| Board Size(mm) |
50(W)x50(L)x0.38(t) ~ 460(W)x510(L)x4(t) |
| Height of Conveyor(mm) |
900(950) |
| Dispensing Prescision(mm) |
±0.1 (3σ) |
| Dispensing Cycle Time |
32,000 DPH (Optimum Conditions) |
| Number of Heads |
2Heads |
| Type of Heads |
Time Pressure Type |
| Accuracy |
Laser Sensor for Z-Axis Height Measurement |
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