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CP40CV

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CP40CV
(High Speed Mounter)

Designed to handle various components from 0603 to QFP & BGA

enhances the line efficiency of production. Over 1000's field proven installation of CP40CV in the world ensures product stability with minumum down time


- 0603 ~ 42x42mm operational
- Fine pitch QFP operation for sub-0.5 mm possible
- Able to operate CSPs, as well as QFP and BGAs
- 0.24 sec/chip (15,000 CPH), IPC based 9,000CPH
- Optimal lighting for each component using digital illuminators
  Recognizes by condition memory

Alignment Unit Laser & Vision System
PCB Size Max:460 x 400 x 4.2~
Min: 50 x 30 x 0.38 (LxWxT)
Placement Rate (Tact Time) Chip (sec/chip) 0.26
QFP (sec/QFP) 1.6 (By vision system)
Feeder Capacity 104ea (8mm tape feeder)
Feeder Type Tape Type 8, 12, 16, 24, 32, 44, 56 Tape Feeder/ Inteligent Feeder System/Bulk Feeder Beit Stick Feeder(stack, multi), Vibratory Stick Feeder(multi), Tray Feeder(1step, 20step, 40step, shuttle type)
Conveyor Direction L→R (RL:option)
Placement Accuracy Chip (mm) 0.1
QFP (mm) ±0.05 (option vision : 0.03)
Applicable Components Chip 1005 chip~(option:0603 chip)
IC Type Max :□42 x 42(0.5mm pitch)
Option ::□
Work Components Chip, SOP, QFP, Connector
Extermal Dimension 1,660x1,540x1,350 (LxWxH, mm)
Power Supply AC 100, 110, 220V, 240V(50/60Hz) 2.6Kw
Air Consumption 5Kg/㎠, 150Nl/min
Net Weight 1,020Kg
Head Head No. 3 Head
Align Size □42 x 42
Application Placemenr Rate 8,000~13,000 CPH
Applicable Components 0603, 1005~, TR MELF, Tantalum, ALEC, SOP, PLCC, QFP(0.8p, 0.65P, 0.5P), PBGA, CBGA, TBGA, CSP, Connector
   

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Email:
hcmc@acrosemi.com
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Email:
hanoi@acrosemi.com

    
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