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We recommend a selection of individual machines to demonstrate the full range of semiconductor assembly processes:
Model 7200CR to die bond a semiconductor chip to a work piece. (61KB)
Model 7476E to bond wires by the Wedge method, with either angled or deep access feed.
Model 7700E to bond wires by the Ball method.
Model 70PTE to verify the processes by pull testing the bonded wires. (45KB)

These machines are direct and rugged, yet operate with smoothness and precision. They are always ready for operation. The photo below will show how this full process line would look.

Model 7200CR to die bond a semiconductor chip to a work piece. Model 7476E to bond wires by the Wedge method. Model 7700E to bond wires by the Ball method. Model 70PTE to verify the processes by pull testing the bonded wires.

For a special package discount to encourage use of the group pictured above. Please contact us for details.



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Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
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Email:
hanoi@acrosemi.com

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