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High Precision Film cut & Alignment
Mis-Alignment Compensation Function
Available for Chip bonded one as well as raw Substrate
Provision for Future Inline with Other Machines
Ionized Air Blowing
Minimized Micro-Bubble
Easy Conversion for Various Size Substrate and reel
User Friendly Software with Various Information System
SIZE : 850mm x 1,900mm x 1,500mm
WEIGHT : APPX. 900 KG |
