TIẾNG VIỆT | ENGLISH

Home Products Top-A Technology Products


MOLD DIE: CONVENTIONAL MOLD

  • Various Molding Capacity up to 12Chase
  • Mismatch & Misalign : max 1.5~2 mils
  • High Productivity with Minimum Investment
  • No Resin & No Flash
  • Compound Saving Design
  • Highest Molding quality
  • Built in Hydraulic unit for Multi Plunger Movement
  • Best Compound Flow & Minimum Wire Sweep
  • Applied PKG : All Device
  • SIZE: 500mm x 600mm x 600mm
  • WEIGHT: 800 KG


  • MOLD DIE: SEMI-MGP MOLD

  • Various Molding Capacity up to 4Chase
  • Mismatch & Misalign : max 1.5~2 mils
  • High Productivity with Minimum Investment
  • No Resin & No Flash
  • Compound Saving Design
  • Highest Molding quality
  • Built in Hydraulic unit for Multi Plunger Movement
  • Best Compound Flow & Minimum Wire Sweep
  • Applied PKG : All Device

  • SIZE: 550mm x 650mm x 600mm
  • WEIGHT: 900 KG


  • MOLD DIE: AUTO MOLD CHASE

  • Mismatch & Misalign : max 1~1.5mils
  • Chase Design : Q. C. C
  • High Productivity with Minimum Investment
  • No Resin & No Flash
  • Compound Saving Design
  • Highest Molding quality
  • Built in Hydraulic unit for Multi Plunger Movement
  • Best Compound Flow & Minimum Wire Sweep
  • Applied PKG : All Device
  • SIZE: 350mm x 250mm x 250mm
  • WEIGHT: 40 KG
  • Top



    Trim&Form System | Mold Die | Strip Blowing System for BGA | Offloading System for BGA | Auto Frame Loader |
    Tape Attachment System | Test Leader



    Ho Chi Minh Office
    Phone: +84(0) 87-309-7282
    Email:
    hcmc@acrosemi.com
    Hanoi Office
    Phone: +84(0) 91-225-7173
    Email:
    hanoi@acrosemi.com

    © 2006-2010 AcroSemi Corporation. All rights reserved.