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TRIM & FORM SYSTEM: CAM PRESS FOR I.C PKG.

  • Compact Machine size, High Throughput
  • Easy Integration with other Process
  • Modular system Design
  • Quick & Easy Conversion System
  • Inspects Various Items without Sacrificing UPH
  • Reject Unit Sorting System
  • User Friendly operation with Various Information System
  • Perfect Quality with Highly Accurate Tool
  • Stroke Speed Control
  • Real-Time spc Monitoring & Graphic Display
  • MTBA/MTBF Data
  • Vision System (Option)

  • SIZE: 1,100mm x 1,500mm x 1,450mm
  • WEIGHT: APPX. 1,500KG
  • POWER: 3PHASE, 220V, 50~60Hz


  • TRIM & FORM SYSTEM: CAM PRESS FOR T.R PKG.

  • Compact Machine size
  • High Throughput
  • Easy Integration with other Process
  • User Friendly operation with Various Information System
  • Perfect Quality with Highly Accurate Tool
  • Stroke Speed Control
  • Real-Time spc Monitoring & Graphic Display
  • Modular Tool Design
  • Inspects Various Items without Sacrificing UPH
  • MTBA/MTBF Data
  • Vision System (Option)

  • SIZE: 900mm x 1,500mm x 1,700mm
  • WEIGHT: APPX. 1,500KG
  • POWER: 3PHASE, 220V, 50~60Hz

  • TRIM & FORM SYSTEM: CAM PRESS FOR M-BGA SINGULATION SYSTEM

  • High Through Put
  • Defect Free Quality by 3Step Vision Inspection
  • Sorting Function of Rejected Package with out Machine Stop
  • Easy Maintenance by Self-diagnosis
  • Tape Remove Unit
  • User friendly Software with Various Information System

  • SIZE: 1,300mm x 1,900mm x 1,550mm
  • WEIGHT: APPX. 1,500KG
  • TYPE : MAGAZINE TO TRAY


  • TRIM & FORM SYSTEM: TRIM & FORM DIE

  • Q.C.C Modular Design
  • Easy Change & Cleaning for Tool Parts
  • Module Change for Different Lead Count & Form Option
  • Diamond Coating for All Forming Parts
  • Longer Life Time
  • Less Solder Build-Up
  • MisFeeding Detection
  • Un-Cut Dambar Detection(Mechanical Type)
  • Minimum in Flake Solder Build-up & foreign Materials
  • Top and Bottom Module Self-Alignment Design
  • Anti Vibration & Noise Protection Design
  • Dambar Protrusion : Max 1.5mils
  • Lead Coplanarity : Max 1.5mils
  • Applied Package All Package
  • Misfeed Sensor

  • SIZE: 300mm x 250mm x 300mm
  • WEIGHT: 40KG
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    Trim&Form System | Mold Die | Strip Blowing System for BGA | Offloading System for BGA | Auto Frame Loader |
    Tape Attachment System |
    Test Leader



    Ho Chi Minh Office
    Phone: +84(8) 5446-4789
    Email:
    hcmc@acrosemi.com
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    Phone: +84(0) 91-225-7173
    Email:
    hanoi@acrosemi.com

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