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Semiconductor Equipment Corporation (S.E.C.) manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment.

Choose a Model from the list below or Click on photo to see larger image.

S.E.C Model 850

Flip Chip Die Bonder
A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.


 Click here for Specifications.

 

S.E.C Model 860

The Eagle Omni Die Bonder
A multi-use semi-automatic system which can be configured for bonding laser diodes, flip chip and eutectic bonded die. 


 Click here for Specifications.
Click here to watch our S.E.C Model 860 in action! (1.7 MB)

 

S.E.C Model 830

Manual Pick & Place System
Pick and Place surface mounted devices from carrier packs onto pre-epoxied surfaces. Transfers die or other devices from tape or carrier trays to any desired packages.


 Click here for Specifications.
Click here to watch our S.E.C Model 830 in action! (1.5 MB)

 

S.E.C Model 4800

Die Ejector Grid
Die Ejector Grid System for loosening die for quick, safe removal from wafer mounting tape.


 Click here for Specifications.

 

S.E.C Model 4750

Die Ejector System (Poker Plate)
Speed up die handling.


 Click here for Specifications.

 

S.E.C Tape

Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing
There is a Semiconductor Equipment Tape that is perfect for your application. 


 Click here for Specifications.
 Request a Dicing Tape Sample.

 

S.E.C UV Tape

UV Curable Tape 
A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. 


 Click here for Specifications.
 Request a Dicing Tape Sample.

 

High Purity Tape

High Purity Pressure Sensitive Expandable Tape with Liner
Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.


 Click here for Specifications.
 Request a Dicing Tape Sample.

 

S.E.C Model 360

UV Exposure System
Revolutionary new design cures UV tapes quickly and uniformly, has an ultra long life light source, and handles all size wafers up to 300mm.


 Click here for Specifications.

 

S.E.C Model 300

Wafer/Frame Tape Applicator
Specifically designed for 300mm wafers.


 Click here for Specifications.

 

S.E.C Model 3100/3150

Wafer/Frame Tape Applicators
Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. 


 Click here for Specifications.

 

S.E.C Model 3200/3250

Wafer/Backlap Applicator
Applies protective tape to your wafer prior to backlapping.


 Click here for Specifications.

 

S.E.C Model 430

Hot Gas Rework Module
Hot gas jet directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.


 Click here for Specifications.

 

S.E.C Model 450

Hot Gas Rework Station
Hot Gas Rework Station removes surface mounted components and bonded die.


 Click here for Specifications.

 

S.E.C Model HS-1810

Die Matrix Expander (New Product!)
Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100 degrees C and built in cutter tape separation system.

 Click here for Specifications.

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Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
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Email:
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