Semiconductor Equipment Corporation (S.E.C.) manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment.
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S.E.C Model 850
Flip Chip Die Bonder
A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.