Home Products Semiconductor Equipment Corporation (S.E.C.) Products

Semiconductor Equipment Corporation (S.E.C.) manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment. Choose a Model from the list below or Click on photo to see larger image.

S.E.C Model 850	Flip Chip Die Bonder A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.  Click here for Specifications.
S.E.C Model 860	The Eagle Omni Die Bonder A multi-use semi-automatic system which can be configured for bonding laser diodes, flip chip and eutectic bonded die.   Click here for Specifications. Click here to watch our S.E.C Model 860 in action! (1.7 MB)
S.E.C Model 830	Manual Pick & Place System Pick and Place surface mounted devices from carrier packs onto pre-epoxied surfaces. Transfers die or other devices from tape or carrier trays to any desired packages.  Click here for Specifications. Click here to watch our S.E.C Model 830 in action! (1.5 MB)
S.E.C Model 4800	Die Ejector Grid Die Ejector Grid System for loosening die for quick, safe removal from wafer mounting tape.  Click here for Specifications.
S.E.C Model 4750	Die Ejector System (Poker Plate) Speed up die handling.  Click here for Specifications.
S.E.C Tape	Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing There is a Semiconductor Equipment Tape that is perfect for your application.   Click here for Specifications.  Request a Dicing Tape Sample.
S.E.C UV Tape	UV Curable Tape  A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.   Click here for Specifications.  Request a Dicing Tape Sample.
High Purity Tape	High Purity Pressure Sensitive Expandable Tape with Liner Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.  Click here for Specifications.  Request a Dicing Tape Sample.
S.E.C Model 360	UV Exposure System Revolutionary new design cures UV tapes quickly and uniformly, has an ultra long life light source, and handles all size wafers up to 300mm.  Click here for Specifications.
S.E.C Model 300	Wafer/Frame Tape Applicator Specifically designed for 300mm wafers.  Click here for Specifications.
S.E.C Model 3100/3150	Wafer/Frame Tape Applicators Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters.   Click here for Specifications.
S.E.C Model 3200/3250	Wafer/Backlap Applicator Applies protective tape to your wafer prior to backlapping.  Click here for Specifications.
S.E.C Model 430	Hot Gas Rework Module Hot gas jet directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.  Click here for Specifications.
S.E.C Model 450	Hot Gas Rework Station Hot Gas Rework Station removes surface mounted components and bonded die.  Click here for Specifications.
S.E.C Model HS-1810	Die Matrix Expander (New Product!) Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100 degrees C and built in cutter tape separation system.  Click here for Specifications. Top