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For more than two decades the Heraeus Contact Materials Division has been the leading manufacturer of materials for packaging technology in the global electronics industry. The main focal points of the Business Unit Microbond Assembly Materials are in demanding applications for automobile and consumer electronics and in semiconductor and packaging applications. The most important criteria in selecting materials are the highest possible quality and process stability.

Our products include:

Automotive & Industrial		Power & Discrete
	- Solder Paste - Fluxes - SMT Adhesive - Conductive Adhesive - Non Conductive Adhesive - Heat Conductive Adhesive - Solder Powder		- Die-Attach Solder Wire - Die-Attach Solder Paste - Fluxes for BGA CSP - Micro Solder Sphere - Dippable Paste - Conductive Adhesive (MSL) - Non Conductive Adhesive (MSL)

Assembly Materials Product Overview (3.2 MB)


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