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The Eagle Omni Die Bonder - S.E.C. Model 860
A multi-use semi-automatic system which can be configured for bonding laser diodes, flip chip and eutectic bonded die.

 Click here for Specifications.



Flip Chip Placement System - S.E.C. Model 850
A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.

 Click here for Specifications.



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