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The Eagle Omni Die Bonder - S.E.C. Model 860 A multi-use semi-automatic system which can be configured for bonding laser diodes, flip chip and eutectic bonded die.  Click here for Specifications. Flip Chip Placement System - S.E.C. Model 850 A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.  Click here for Specifications. Ho Chi Minh Office Phone: +84(8) 5446-4789 Email: hcmc@acrosemi.com Hanoi Office Phone: +84(0) 91-225-7173 Email: hanoi@acrosemi.com © 2006-2010 AcroSemi Corporation. All rights reserved.