|
FOR HIGH RELIABILITY WAFER BONDINGThe 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.
Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000°C optional). Bellows actuated clamping platens present uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities.
TYPICAL APPLICATIONS:
Many Uses Include:
- Silicon to Glass Wafer Bonding
- MEMS Wafer Bonding
- Pressure Sensor Bonding
- Anodic Wafer Bonding
CONTROL SYSTEMThe 3180 and 3190 utilize distributed logic systems that link intelligent temperature and pressure controllers to a Windows based central control. All process parameters are controlled automatically with user-edited programs for each application. Multiple temperature ramps and soaks, vacuum and pressure cycling, mechanical wafer clamping force and anodic power supply settings are easily programmed as time-based events. Furnace operating characteristics are continuously monitored and the operator is alerted to any fault conditions. The operator interface features a color touch-screen display. For process engineers and maintenance personnel a standard computer keyboard is provided behind a locking front panel. All process profile results, including ultimate vacuum levels, are stored directly on the system hard drive.
SELECTED 3180/3190 OPTIONS
 Custom Graphite Tooling
Extended Temperature Range (1000 °C)
Residual Gas Analyzer (RGA)
Multiple Zone Temperature Recording
Moisture Level Recording
Internet Connectivity
Cooling Water Chiller/Pump
Light Tree
Color Inkjet Printer
CE Certification for European Market
SPECIFICATIONS*
|
|
MODEL 3180 |
MODEL 3190 |
|
Vacuum Pump Type |
Mechanical |
Cryogenic |
|
Minimum Vacuum Level |
50 millitorr (.05 mbar) |
1 x 10-6 torr (1 x 10-6 mbar) |
|
Operating Temperature Range |
RT to 500 °C (1000 °C option) |
|
Thermal Work Zone |
6 in (150 mm) diameter |
|
Mechanical Clamping Pressure |
0 - 750 lb (0 - 350 kg) adjustable |
|
Anodic Bonding Voltage |
not applicable
|
0 - 5000 volts typical |
|
Maximum Chamber Gas Pressure Level |
50 psig (4.5 bar)
|
15 psig (2 bar) |
|
Process Gasses
(three inputs) |
N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar) minimum pressure
|
|
Electrical Service |
208-240 volts, 60 amps, 60/50 Hz, 1 phase, 5 kilowatt average, 15 kilowatt peak |
|
Cooling Water Required |
2 GPM (8 lpm) @ 20-25 °C, 2 kilowatt capacity minimum |
|
Compressed Air Required |
90 psig (7 bar), ¼ in (6.5 mm) inside diameter line |
|
Work Surface Height |
37 in (95 cm) adjustable |
|
Overall Size
(W x D x H) |
58 x 54 x 53 in
(147 x 137 x 135 cm) |
94 x 54 x 53 in
(239 x 137 x 135 cm) |
|
Helium Compressor Size (W x D x H) |
not applicable |
20 x 22 x 17 in
(50 x 57 x 43 cm) |
|
Total Weight |
1400 lb (650 kg) |
2400 lb (1100 kg) |
* Specifications subject to change.
|
Top