The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.
Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000°C optional). Bellows actuated clamping platens present uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities.
Many Uses Include:
Silicon to Glass Wafer Bonding
MEMS Wafer Bonding
Pressure Sensor Bonding
Anodic Wafer Bonding
The 3180 and 3190 utilize distributed logic systems that link intelligent temperature and pressure controllers to a Windows based central control. All process parameters are controlled automatically with user-edited programs for each application. Multiple temperature ramps and soaks, vacuum and pressure cycling, mechanical wafer clamping force and anodic power supply settings are easily programmed as time-based events. Furnace operating characteristics are continuously monitored and the operator is alerted to any fault conditions. The operator interface features a color touch-screen display. For process engineers and maintenance personnel a standard computer keyboard is provided behind a locking front panel. All process profile results, including ultimate vacuum levels, are stored directly on the system hard drive.
SELECTED 3180/3190 OPTIONS
Custom Graphite Tooling
Extended Temperature Range (1000 °C)
Residual Gas Analyzer (RGA)
Multiple Zone Temperature Recording
Moisture Level Recording
Cooling Water Chiller/Pump
Color Inkjet Printer
CE Certification for European Market