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Wafer Bonders - Model 3180/3190


The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter. Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000°C optional). Bellows actuated clamping platens present uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities.


    Many Uses Include:

    • Silicon to Glass Wafer Bonding
    • MEMS Wafer Bonding
    • Pressure Sensor Bonding
    • Anodic Wafer Bonding


The 3180 and 3190 utilize distributed logic systems that link intelligent temperature and pressure controllers to a Windows based central control. All process parameters are controlled automatically with user-edited programs for each application. Multiple temperature ramps and soaks, vacuum and pressure cycling, mechanical wafer clamping force and anodic power supply settings are easily programmed as time-based events. Furnace operating characteristics are continuously monitored and the operator is alerted to any fault conditions. The operator interface features a color touch-screen display. For process engineers and maintenance personnel a standard computer keyboard is provided behind a locking front panel. All process profile results, including ultimate vacuum levels, are stored directly on the system hard drive.


    Custom Graphite Tooling
    Extended Temperature Range (1000 °C)
    Residual Gas Analyzer (RGA)
    Multiple Zone Temperature Recording
    Moisture Level Recording
    Internet Connectivity
    Cooling Water Chiller/Pump
    Light Tree
    Color Inkjet Printer
    CE Certification for European Market



MODEL 3180

MODEL 3190

Vacuum Pump Type



Minimum Vacuum Level

50 millitorr (.05 mbar)

1 x 10-6 torr (1 x 10-6 mbar)

Operating Temperature Range

RT to 500 °C (1000 °C option)

Thermal Work Zone

6 in (150 mm) diameter

Mechanical Clamping Pressure

0 - 750 lb (0 - 350 kg) adjustable

Anodic Bonding Voltage

not applicable

0 - 5000 volts typical

Maximum Chamber Gas Pressure Level

50 psig (4.5 bar)

15 psig (2 bar)

Process Gasses
(three inputs)

N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar) minimum pressure

Electrical Service

208-240 volts, 60 amps, 60/50 Hz, 1 phase, 5 kilowatt average, 15 kilowatt peak

Cooling Water Required

2 GPM (8 lpm) @ 20-25 °C, 2 kilowatt capacity minimum

Compressed Air Required

90 psig (7 bar), ¼ in (6.5 mm) inside diameter line

Work Surface Height

37 in (95 cm) adjustable

Overall Size
(W x D x H)

58 x 54 x 53 in
(147 x 137 x 135 cm)

94 x 54 x 53 in
(239 x 137 x 135 cm)

Helium Compressor Size (W x D x H)

not applicable

20 x 22 x 17 in
(50 x 57 x 43 cm)

Total Weight

1400 lb (650 kg)

2400 lb (1100 kg)

* Specifications subject to change.


Wafer Bonders | Vacuum / Pressure Furnaces | Graphite Machining

Click here for more information or contact our offices in Vietnam:
Ho Chi Minh Office
Phone: +84(8) 5446-4789
Hanoi Office
Phone: +84(0) 91-225-7173

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