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Model 3140/3150 High Vacuum Furnaces

FOR HIGH RELIABILITY MICROELECTRONIC PACKAGE ASSEMBLY

The 3140 and 3150 are high vacuum furnaces offered by SST International for high-reliability microelectronic package assembly. Packages are hermetically sealed with very low internal gas pressures and moisture levels. Prior to package sealing, integral getters may also be activated to ensure long-term internal package vacuum levels.

Both the 3140 and 3150 systems provide precise automatic control of both heating and cooling. Temperatures up to 500 °C are easily achieved in vacuum levels below 1 x 10-6 torr and in positive inert gas pressures up to 15 psig. The 3140 utilizes a cryogenic vacuum pumping system for the most effective pumping of water molecules. The 3150 utilizes a turbomolecular drag pump for the best pumping of hydrogen gas molecules. Both systems are backed by an oil-free roughing pump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities. Custom-designed resistive graphite heating fixtures (ordered separately) are matched to user application requirements for optimum system performance. An automatically controlled linear motion stage provides component separation during thermal processing and getter activation.



TYPICAL APPLICATIONS

Many Uses Include:

 

 MEMS Package Sealing
Infrared Sensor Package Sealing
Crystal Oscillator Package Sealing
Getter Activation
Hermetic Package Sealing

 Wafer Level Packaging
Void-Free Eutectic Die Attach
Low Moisture Package Sealing
Nobel Gas Miniature Lamp Sealing
Military Electronic Package Sealing



CONTROL SYSTEM

 

The 3140 and 3150 utilize distributed logic systems that link intelligent temperature and pressure controllers to a Windows® based central control. All process parameters are controlled automatically with user-edited programs for each application. Multiple temperature ramps and soaks, vacuum and pressure cycling, getter activation and component separation are easily programmed as time-based events. Furnace operating characteristics are continuously monitored and the operator is alerted to any fault conditions. The operator interface features a color touch-screen display. For process engineers and maintenance personnel a standard computer keyboard is provided behind a locking front panel. All process profile results, including ultimate vacuum levels, are stored directly on the system hard drive.


Ceramic MEMS Package with Getter Attached to Lid

SELECTED 3140/3150 OPTIONS


• Custom Graphite Tooling
• Extended Temperature Range (1000 °C)
• Residual Gas Analyzer (RGA)
• Electrical Getter Activation
• Multiple Zone Temperature Recording
• Moisture Level Recording
• Internet Connectivity
• Cooling Water Chiller/Pump
• Light Tree
• Color Inkjet Printer
• CE Certification for European Market


All Stainless Steel Process Chamber with Resistive Heating Fixture

SPECIFICATIONS*
 

Model 3140

Model 3150

Vacuum Pump Type

Cryogenic

Turbomolecular Drag

Minimum Vacuum Level

1 x 10-6 torr (1 x 10-6 mbar)

Operating Temperature Range

RT to 500 °C (1000 °C option)

Thermal Work Zone

35 in2 (225 cm2)

Maximum Chamber Gas Pressure Level

0 - 750 lb (0 - 350 kg) adjustable

Process Gasses
(three inputs)

N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar)
minimum pressure

Electrical Service

208-240 volts, 60 amps, 60/50 Hz, 1 phase, 5 kilowatt average,
15 kilowatt peak

Cooling Water Required

2 GPM (8 lpm) @ 20-25 °C, 2 kilowatt capacity minimum

Compressed Air Required

90 psig (7 bar)

Work Surface Height

37 in (95 cm) adjustable

Overall Size
(W x D x H)

94 x 54 x 53 in (239 x 137 x 135 cm)

Helium Compressor Size (W x D x H)

20 x 22 x 17 in
(50 x 57 x 43 cm)

not applicable

Total Weight

2200 lb (1000 kg)

2000 lb (900 kg)

* Specifications subject to change.

View Model 3140/3150 Brochure (240 KB) Top

Wafer Bonders | Vacuum / Pressure Furnaces | Graphite Machining



Click here for more information or contact our offices in Vietnam:
Ho Chi Minh Office
Phone: +84(8) 5446-4789
Email:
hcmc@acrosemi.com
Hanoi Office
Phone: +84(0) 91-225-7173
Email:
hanoi@acrosemi.com

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