Your browser does not support script
SST International Products
SST International offers several models of vacuum / pressure furnaces for flux-free, void-free soldering, brazing and glass sealing.
Ideal for low volume, high reliability hermetic package sealing, eutectic die attach, process development and university research. Model 1200 Table Top Solder Reflow Station
Model 1200 Brochure (370 KB)
The industry standard for flux-free, void-free solder Model 3130 Vacuum/Pressure Furnace
assembly of hybrids, fiber optic packages, power devices,
BGA devices, plus high temperature glass sealing and
Model 3130 Brochure (306 KB)
High vacuum thermal processing furnaces used for Model 3140 and 3150 High Vacuum Furnaces
MEMS package sealing, getter activation and very high
reliability, low moisture hermetic package sealing.
Model 3140 and 3150 Brochure (240 KB)
Designed for high volume, void-free, vacuum soldering Model PF-2400 High Volume Production Furnace
of devices such as high power rectifiers, large hybrid
modules and BGA panels. Top
Click here for more information or contact our offices in Vietnam:
© 2006-2010 AcroSemi Corporation. All rights reserved.