SST International offers several models of vacuum / pressure furnaces for flux-free, void-free soldering, brazing and glass sealing.

Model 1200 Table Top Solder Reflow Station
Ideal for low volume, high reliability hermetic package sealing, eutectic die attach, process development and university research.
Model 1200 Brochure (370 KB)

Model 3130 Vacuum/Pressure Furnace
The industry standard for flux-free, void-free solder
assembly of hybrids, fiber optic packages, power devices,
BGA devices, plus high temperature glass sealing and
brazing processes.
Model 3130 Brochure (306 KB)

Model 3140 and 3150 High Vacuum Furnaces
High vacuum thermal processing furnaces used for
MEMS package sealing, getter activation and very high
reliability, low moisture hermetic package sealing.
Model 3140 and 3150 Brochure (240 KB)

Model PF-2400 High Volume Production Furnace
Designed for high volume, void-free, vacuum soldering
of devices such as high power rectifiers, large hybrid
modules and BGA panels.