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An On-going Success Story
The 7100 Dicing System is an industry leading platform designed for a variety of applications such as:
- Ceramic Substrates & Capacitors
- Automotive Sensors
- Glass
- Glass on Silicon
- PZT
- SAW Filters
- Sensors & MEMS
- LED & LED on PCB Packages
- Package Singulation (BGA, QFN)
- LTCC
- Opto-electronic Components
- IC Wafers
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7100 Series Advantages
- 2" and 4" spindle dicing systems
- A full range of automatic vision capabilities
- Advanced hardware platform for high reliability and low maintenance
- Heavy Duty, cast-iron base structure for superior precision and accuracy
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly, Windows XP based Software platform
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