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With three different models to choose from, each optimized for a specific range of applications, the 7200 Series is designed to optimize for IC applications, package singulation or hard material applications.

The 7200 Series Step into the Future of Dicing With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications: Silicon Glass on Silicon MEMS GaAs wafers Package Singulation (BGA & QFN) LTCC PCB Hard Materials 7200 Series Advantages Unique Wx3 wafer handling system streamlines wafer flow for greater productivity Continuous digital magnification vision System provides optimal magnification for any eye-point Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH Touch panel display supports a user-friendly graphical interface (GUI) Atomized wafer cleaning technology for superior process results Dedicated dressing cassette enables automatic blade dressing Built-in Inspection tray allows for in-process quality assessment Small footprint Click here to find out more or select model below that includes your application: ProDice MegaDice GigaDice View 7200 Brochure (1,760Kb)