Home Products Advanced Dicing Technologies (ADT) Products Peripheral Equipment


Wafer Mounting Station - Model 966

A versatile mounting unit provides uniform, bubble-free wafer mounting for substrates up to 8” in diameter.

	System Highlights: Uniform mounting and tensioning without forming air bubbles Built- in reeling and removal of UV tape backing Compatibility with all film frames Programmable temperature regulation built- in circular blade cuts leftover tape Optional ESD protection Optional non- contact mounting
View Model 966 Brochure (327Kb)