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Wafer Cleaning Station - Models 974, 975, 976

The cleaning station is designed for sub-micron cleansing of wafers and other diced materials. The system utilizes a high-pressure, de-ionized water spray with optional, fixed or oscillating surfactant dispensers. The system offers rapid drying combining a variable spin centrifuge with nitrogen blow-off and an optional IR heat lamp. Model 974, a microprocessor-controlled version of the 976, enables storage of multiple programs.

Features & Advantages: Oscillating high pressure D.I. water jet adjustable to 2000 PSI (13.8 Mpa) Microprocessor (optional) Variable spin speed Nitrogen blow-off Model 974 wafer/substrate diameter up to 10” Model 975 wafer/substrate diameter up to 12” Model 976 wafer/substrate diameter up to 8” Specifications - Model 976 Power: 220 VAC, 60 Hz; 220 VAC, 50 Hz D.I. water: 2 liter/min (0.5 GPM), 350 kPa (50 PSI) Nitrogen: 30 liter/min (1 CFM), 500 kPa (70 PSI) Weight: 90 kg (200 lbs) Air drying & cleaning: 200 liter/min (7 CFM), 550 kPa (80 PSI)