Home Products Advanced Dicing Technologies (ADT) Products

With ever-increasing transistor density, shrinking metal lines and gate dimensions, producers are forced to use metals of higher conductivity such as copper, "low-k" isolation materials such as "black diamond" and more test pads.   These new manufacturing standards set a different threshold for wafer singulation whereby traditional step cut dicing no longer meets the quality requirements and cost targets for manufacturing. ADT meets the market challenge with a new, revolutionary type of laser for wafer scribing that is The 8000 Series - NextStep Laser Scribing System ADT’s NextStep Laser Scribing System removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then be diced using a standard mechanical dicing process.   NextStep Process Advantages     Silicon transparency to the radiation      No micro-cracking and no delamination     One pass process at 600 mm per second      Attractive cost-of-ownership   View NextStep Laser Scribing System Brochure (717Kb)

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