2"-3" High-torque, DC-brushless, Air-bearing, 2.4 kW, 60 krpm spindle system, optimized for package singulation and IC applications.
System
Work piece size: up to 200 x 200 mm
Package singulation: up to 235 x 170 mm
Blade size: 2"-3"
Spindle: Air bearing, DC-brushless, 60 krpm, 2.4 kW
Indexing Axis (y)
Drive: ball bearing lead screw with stepper motor
Control: linear encoder
Resolution: 0.2 micron
Cumulative accuracy: 1.5 micron
Indexing accuracy: 1.0 micron
Feed Axis (x)
Drive: ball bearing lead screw with DC-brushless motor
Feed rate: up to 700 mm/sec
Cut Deapth Axis (z)
Drive: ball bearing lead screw with DC-brushless motor
Resolution: 0.2 micron
Accuracy: 2.0 micron
repeatability: 1.0 micron
Rotary Axis (T)
Drive: closed-loop, direct-drive, DC-brushless
Accuracy: 4 arc-sec
Repeatability: 4 arc-sec
Stroke: 350 deg.
Vision System
Digital camera
High bright LED illumination (vertical & oblique)
Continuous digital magnification: from x 170 to x 280 or, from x 35 to x140 (optional)
Cleaning station - Full rinse and dry cycle
Spinning speed: 100-2500 RPM
High pressure: up to 10 MPa
Atomizing capabilities
Additives (optional)
Wafer handling system
Slot to slot integrity
Dress cassette
Inspection drawer
UV curing station (optional)
Barcode reader (optional)
SECS-GEM host communication (optional)
User Interface
Flat 15" touch screen
Graphical User Interface (GUI)
Multilanguage support
Keyboard & mouse (optional)
Utilities
Electrical: 200-240 Single phase VAC 50/60 Hz
Air/N2: 700 L/min @ 5.5 bar
500 L/min compressed air, 200 L/min process air/ N2
Spindle coolant: 1.1 L/min tap water
Process Water (DI): Blade/process coolant - up to 7 L/min
High pressure cleaning - up to 5 L/min
Dimensions
(WxDxH): 965 x 1460 x 1700 mm
Weight: 1200 kg
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