The Large Area capability available with the ProVectus and ProFortis Models of the 7100 Series was developed primarily for customers who are interested in processing 12” wafers or singulating large PBGA and CBGA substrates. The Increased X, Y and theta axis travel combined with closed-loop Y and theta axis control allow the highest level of precision needed for making long cuts over large distances.
- Allows Dicing of 12” x 12” Substrates (without frame) or 12” Diameter Wafers (with frames)
- Available on the 2” spindle ProVectus or 4” spindle ProFortis
- Does not increase the footprint of 7100 Series base architecture
- Increased theta precision for high accuracy over long cut lengths
- Spacious load and unload area for large substrates and 12” wafers
- Excellent for singulating large PCB or ceramic substrates
- Stationary, non-contact height compensation for 2” or 4” systems
- Customized chuck configurations
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